Methods for top-down fabrication of wafer scale TMDC monolayers
Abstract
A method of forming a TMDC monolayer comprises providing a multi-layer transition metal dichalcogenide (TMDC) film. The multi-layer TMDC film comprises a plurality of layers of the TMDC. The multi-layer TMDC film is positioned on a conducting substrate. The conducting substrate is contacted with an electrolyte solution. A predetermined electrode potential is applied on the conducting substrate and the TMDC monolayer for a predetermined time. A portion of the plurality of layers of the TMDC included in the multi-layer TMDC film is removed by application of the predetermined electrode potential, thereby leaving a TMDC monolayer film positioned on the conducting substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1407949
- Patent Number(s):
- 9809903
- Application Number:
- 15/061,696
- Assignee:
- UChicago Argonne, LLC
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25F - PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016 Mar 04
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Citation Formats
Das, Saptarshi, Bera, Mrinal K., Roelofs, Andreas K, and Antonio, Mark. Methods for top-down fabrication of wafer scale TMDC monolayers. United States: N. p., 2017.
Web.
Das, Saptarshi, Bera, Mrinal K., Roelofs, Andreas K, & Antonio, Mark. Methods for top-down fabrication of wafer scale TMDC monolayers. United States.
Das, Saptarshi, Bera, Mrinal K., Roelofs, Andreas K, and Antonio, Mark. Tue .
"Methods for top-down fabrication of wafer scale TMDC monolayers". United States. https://www.osti.gov/servlets/purl/1407949.
@article{osti_1407949,
title = {Methods for top-down fabrication of wafer scale TMDC monolayers},
author = {Das, Saptarshi and Bera, Mrinal K. and Roelofs, Andreas K and Antonio, Mark},
abstractNote = {A method of forming a TMDC monolayer comprises providing a multi-layer transition metal dichalcogenide (TMDC) film. The multi-layer TMDC film comprises a plurality of layers of the TMDC. The multi-layer TMDC film is positioned on a conducting substrate. The conducting substrate is contacted with an electrolyte solution. A predetermined electrode potential is applied on the conducting substrate and the TMDC monolayer for a predetermined time. A portion of the plurality of layers of the TMDC included in the multi-layer TMDC film is removed by application of the predetermined electrode potential, thereby leaving a TMDC monolayer film positioned on the conducting substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 07 00:00:00 EST 2017},
month = {Tue Nov 07 00:00:00 EST 2017}
}
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