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Title: Wafer scale micromachine assembly method

Abstract

A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

Inventors:
 [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
874181
Patent Number(s):
6332568
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
wafer; scale; micromachine; assembly; method; fusing; diffusion; bonding; subassemblies; separately; fabricated; described; subassembly; substrate; substrates; positioned; upper; surfaces; aligned; results; fusion; brought; contact; subjected; conditions; suited; upper surface; diffusion bonding; /228/

Citation Formats

Christenson, Todd R. Wafer scale micromachine assembly method. United States: N. p., 2001. Web.
Christenson, Todd R. Wafer scale micromachine assembly method. United States.
Christenson, Todd R. Mon . "Wafer scale micromachine assembly method". United States. https://www.osti.gov/servlets/purl/874181.
@article{osti_874181,
title = {Wafer scale micromachine assembly method},
author = {Christenson, Todd R.},
abstractNote = {A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Patent:

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