Wafer scale micromachine assembly method
Abstract
A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 874181
- Patent Number(s):
- 6332568
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- wafer; scale; micromachine; assembly; method; fusing; diffusion; bonding; subassemblies; separately; fabricated; described; subassembly; substrate; substrates; positioned; upper; surfaces; aligned; results; fusion; brought; contact; subjected; conditions; suited; upper surface; diffusion bonding; /228/
Citation Formats
Christenson, Todd R. Wafer scale micromachine assembly method. United States: N. p., 2001.
Web.
Christenson, Todd R. Wafer scale micromachine assembly method. United States.
Christenson, Todd R. Mon .
"Wafer scale micromachine assembly method". United States. https://www.osti.gov/servlets/purl/874181.
@article{osti_874181,
title = {Wafer scale micromachine assembly method},
author = {Christenson, Todd R},
abstractNote = {A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}
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Works referenced in this record:
Editorial Board
journal, December 2001
- ,
- Seminars in Arthritis and Rheumatism, Vol. 31, Issue 3, p. A1