Title: Protection of microelectronic devices during packaging

Abstract

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Inventors:

Peterson, Kenneth A ^[1]; Conley, William R ^[2]

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+ Show Inventor Affiliations

1. Albuquerque, NM
2. Tijeras, NM

Issue Date:

Tue Jan 01 00:00:00 EST 2002

Research Org.:

Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:

874193

Patent Number(s):

6335224

Assignee:

Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

B81C1/00333 - {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325}
B81C1/00896 - {Temporary protection during separation into individual elements}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/56 - Encapsulations, e.g. encapsulation layers, coatings
H01L21/561 - {Batch processing}
H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L2224/45099 - Material
H01L2224/48091 - Arched
H01L2224/48227 - connecting the wire to a bond pad of the item
H01L2224/48465 - the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
H01L2224/73265 - Layer and wire connectors
H01L2224/83001 - involving a temporary auxiliary member not forming part of the bonding apparatus
H01L2224/85001 - involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
H01L23/293 - {Organic, e.g. plastic}
H01L24/48 - {of an individual wire connector}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/01013 - Aluminum [Al]
H01L2924/01078 - Platinum [Pt]
H01L2924/01079 - Gold [Au]
H01L2924/14 - Integrated circuits
H01L2924/15153 - the die mounting substrate comprising a recess for hosting the device
H01L2924/15165 - Monolayer substrate

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DOE Contract Number:  

AC04-94AL85000

Resource Type:

Patent

Country of Publication:

United States

Language:

English

Subject:

protection; microelectronic; devices; packaging; relates; method; protecting; device; including; steps; applying; water-insoluble; protective; coating; sensitive; performing; step; substantially; removing; dry; plasma; etching; released; mems; element; disposed; wafer; vacuum; vapor-deposited; parylene; polymer; silicon; nitride; metal; aluminum; tungsten; vapor; deposited; organic; material; cynoacrylate; carbon; film; self-assembled; monolayered; perfluoropolyether; hexamethyldisilazane; perfluorodecanoic; carboxylic; acid; dioxide; silicate; glass; combinations; providing; package; attaching; electrically; interconnecting; silicon nitride; vapor deposited; electronic device; /438/