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Title: Sealed symmetric multilayered microelectronic device package with integral windows

Abstract

A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

Inventors:
 [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
874922
Patent Number(s):
6489670
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
sealed; symmetric; multilayered; microelectronic; device; package; integral; windows; housing; devices; semiconductor; chip; ccd; cmos; vcsel; laser; diode; mems; imems; formed; low-temperature; cofired; ceramic; ltcc; high-temperature; htcc; multilayer; processes; simultaneously; joined; processing; flip-chip; bonded; oriented; light-sensitive; optically; accessible; result; compact; low-profile; hermetically-sealed; laser diode; mems device; semiconductor chip; electronic device; /257/

Citation Formats

Peterson, Kenneth A, and Watson, Robert D. Sealed symmetric multilayered microelectronic device package with integral windows. United States: N. p., 2002. Web.
Peterson, Kenneth A, & Watson, Robert D. Sealed symmetric multilayered microelectronic device package with integral windows. United States.
Peterson, Kenneth A, and Watson, Robert D. Tue . "Sealed symmetric multilayered microelectronic device package with integral windows". United States. https://www.osti.gov/servlets/purl/874922.
@article{osti_874922,
title = {Sealed symmetric multilayered microelectronic device package with integral windows},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

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