Sealed symmetric multilayered microelectronic device package with integral windows
Abstract
A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 874922
- Patent Number(s):
- 6489670
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- sealed; symmetric; multilayered; microelectronic; device; package; integral; windows; housing; devices; semiconductor; chip; ccd; cmos; vcsel; laser; diode; mems; imems; formed; low-temperature; cofired; ceramic; ltcc; high-temperature; htcc; multilayer; processes; simultaneously; joined; processing; flip-chip; bonded; oriented; light-sensitive; optically; accessible; result; compact; low-profile; hermetically-sealed; laser diode; mems device; semiconductor chip; electronic device; /257/
Citation Formats
Peterson, Kenneth A, and Watson, Robert D. Sealed symmetric multilayered microelectronic device package with integral windows. United States: N. p., 2002.
Web.
Peterson, Kenneth A, & Watson, Robert D. Sealed symmetric multilayered microelectronic device package with integral windows. United States.
Peterson, Kenneth A, and Watson, Robert D. Tue .
"Sealed symmetric multilayered microelectronic device package with integral windows". United States. https://www.osti.gov/servlets/purl/874922.
@article{osti_874922,
title = {Sealed symmetric multilayered microelectronic device package with integral windows},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}