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Title: Flexible packaging for microelectronic devices

Abstract

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1444072
Patent Number(s):
9978895
Application Number:
14/068,189
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Oct 31
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Anderson, Benjamin John, Nielson, Gregory N., Cruz-Campa, Jose Luis, Okandan, Murat, Lentine, Anthony L., and Resnick, Paul J. Flexible packaging for microelectronic devices. United States: N. p., 2018. Web.
Anderson, Benjamin John, Nielson, Gregory N., Cruz-Campa, Jose Luis, Okandan, Murat, Lentine, Anthony L., & Resnick, Paul J. Flexible packaging for microelectronic devices. United States.
Anderson, Benjamin John, Nielson, Gregory N., Cruz-Campa, Jose Luis, Okandan, Murat, Lentine, Anthony L., and Resnick, Paul J. Tue . "Flexible packaging for microelectronic devices". United States. https://www.osti.gov/servlets/purl/1444072.
@article{osti_1444072,
title = {Flexible packaging for microelectronic devices},
author = {Anderson, Benjamin John and Nielson, Gregory N. and Cruz-Campa, Jose Luis and Okandan, Murat and Lentine, Anthony L. and Resnick, Paul J.},
abstractNote = {An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}

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