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Title: Flexible packaging for microelectronic devices

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.
Inventors:
; ; ; ; ;
Issue Date:
OSTI Identifier:
1444072
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL
Patent Number(s):
9,978,895
Application Number:
14/068,189
Contract Number:
AC04-94AL85000
Resource Relation:
Patent File Date: 2013 Oct 31
Research Org:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English

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