Flexible packaging for microelectronic devices
An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.
- Issue Date:
- OSTI Identifier:
- 1444072
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL
- Patent Number(s):
- 9,978,895
- Application Number:
- 14/068,189
- Contract Number:
- AC04-94AL85000
- Resource Relation:
- Patent File Date: 2013 Oct 31
- Research Org:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org:
- USDOE
- Country of Publication:
- United States
- Language:
- English
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