Flexible packaging for microelectronic devices

Title: Flexible packaging for microelectronic devices

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An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

Inventors:: Anderson, Benjamin John; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Okandan, Murat; Lentine, Anthony L.; Resnick, Paul J.

Issue Date:: 2018-05-22

OSTI Identifier:: 1444072

Assignee:: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL

Patent Number(s):: 9,978,895

Application Number:: 14/068,189

Contract Number:: AC04-94AL85000

Resource Relation:: Patent File Date: 2013 Oct 31

Research Org:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

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