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Title: Temporary coatings for protection of microelectronic devices during packaging

Abstract

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175208
Patent Number(s):
6844623
Application Number:
09/955,722
Assignee:
Sandia Corporation
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Peterson, Kenneth A., and Conley, William R. Temporary coatings for protection of microelectronic devices during packaging. United States: N. p., 2005. Web.
Peterson, Kenneth A., & Conley, William R. Temporary coatings for protection of microelectronic devices during packaging. United States.
Peterson, Kenneth A., and Conley, William R. Tue . "Temporary coatings for protection of microelectronic devices during packaging". United States. https://www.osti.gov/servlets/purl/1175208.
@article{osti_1175208,
title = {Temporary coatings for protection of microelectronic devices during packaging},
author = {Peterson, Kenneth A. and Conley, William R.},
abstractNote = {The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {1}
}

Works referenced in this record:

Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines
journal, June 1998


C-shield parylene allows major weight saving for EM shielding of microelectronics
conference, January 1997


Interface-adhesion-enhanced bi-layer conformal coating for avionics application
conference, March 1999

  • Wu, Jiali; Pike, R. T.; Wong, C. P.
  • Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
  • https://doi.org/10.1109/ISAPM.1999.757330

Internal Conformal Coatings for Microcircuits
journal, December 1978


Hermetic plastic packages with applications to ruggedized boards
conference, January 1991