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Title: Bi-level multilayered microelectronic device package with an integral window

Abstract

A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

Inventors:
 [1];  [2]
  1. (Albuquerque, NM)
  2. (Tijeras, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
874949
Patent Number(s):
6495895
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
bi-level; multilayered; microelectronic; device; package; integral; window; housing; semiconductor; chip; ccd; cmos; vcsel; laser; diode; mems; imems; formed; low-temperature; cofired; ceramic; ltcc; high-temperature; htcc; multilayer; processes; simultaneously; joined; processing; flip-chip; bonded; oriented; light-sensitive; optically; accessible; backside; wirebonded; level; result; compact; low-profile; hermetically-sealed; laser diode; mems device; semiconductor chip; electronic device; /257/

Citation Formats

Peterson, Kenneth A., and Watson, Robert D. Bi-level multilayered microelectronic device package with an integral window. United States: N. p., 2002. Web.
Peterson, Kenneth A., & Watson, Robert D. Bi-level multilayered microelectronic device package with an integral window. United States.
Peterson, Kenneth A., and Watson, Robert D. Tue . "Bi-level multilayered microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/874949.
@article{osti_874949,
title = {Bi-level multilayered microelectronic device package with an integral window},
author = {Peterson, Kenneth A. and Watson, Robert D.},
abstractNote = {A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

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