Method and apparatus for improving the performance of light emitting diodes
Abstract
A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.
- Inventors:
-
- Fremont, CA
- Union City, CA
- Cedar Crest, NM
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 870408
- Patent Number(s):
- 5514627
- Assignee:
- Hewlett-Packard Company (Palo Alto, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- AC04-76
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; apparatus; improving; performance; light; emitting; diodes; increasing; resistance; diode; semiconductor; devices; extremes; temperature; disclosed; manufacture; liquid; coating; applied; die; placed; lead; frame; frames; thermosetting; encapsulant; material; operation; cures; leaves; intact; expand; contract; rates; respect; changes; encapsulating; adheres; reduces; stresses; expansion; contraction; normally; eliminating; adherence; emitting diodes; emitting diode; semiconductor device; semiconductor devices; light emitting; encapsulating material; /438/
Citation Formats
Lowery, Christopher H, McElfresh, David K, Burchet, Steve, Adolf, Douglas B, and Martin, James. Method and apparatus for improving the performance of light emitting diodes. United States: N. p., 1996.
Web.
Lowery, Christopher H, McElfresh, David K, Burchet, Steve, Adolf, Douglas B, & Martin, James. Method and apparatus for improving the performance of light emitting diodes. United States.
Lowery, Christopher H, McElfresh, David K, Burchet, Steve, Adolf, Douglas B, and Martin, James. Mon .
"Method and apparatus for improving the performance of light emitting diodes". United States. https://www.osti.gov/servlets/purl/870408.
@article{osti_870408,
title = {Method and apparatus for improving the performance of light emitting diodes},
author = {Lowery, Christopher H and McElfresh, David K and Burchet, Steve and Adolf, Douglas B and Martin, James},
abstractNote = {A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1996},
month = {Mon Jan 01 00:00:00 EST 1996}
}