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Title: Light emitting diode with porous SiC substrate and method for fabricating

Abstract

A method and apparatus for forming a porous layer on the surface of a semiconductor material wherein an electrolyte is provided and is placed in contact with one or more surfaces of a layer of semiconductor material. The electrolyte is heated and a bias is introduced across said electrolyte and the semiconductor material causing a current to flow between the electrolyte and the semiconductor material. The current forms a porous layer on the one or more surfaces of the semiconductor material in contact with the electrolyte. The semiconductor material with its porous layer can serve as a substrate for a light emitter. A semiconductor emission region can be formed on the substrate. The emission region is capable of emitting light omnidirectionally in response to a bias, with the porous layer enhancing extraction of the emitting region light passing through the substrate.

Inventors:
; ;
Issue Date:
Research Org.:
Cree, Inc., Goleta, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175568
Patent Number(s):
6972438
Application Number:
10/676,953
Assignee:
Cree, Inc. (Goleta, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
FC26-00NT40985
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Li, Ting, Ibbetson, James, and Keller, Bernd. Light emitting diode with porous SiC substrate and method for fabricating. United States: N. p., 2005. Web.
Li, Ting, Ibbetson, James, & Keller, Bernd. Light emitting diode with porous SiC substrate and method for fabricating. United States.
Li, Ting, Ibbetson, James, and Keller, Bernd. Tue . "Light emitting diode with porous SiC substrate and method for fabricating". United States. https://www.osti.gov/servlets/purl/1175568.
@article{osti_1175568,
title = {Light emitting diode with porous SiC substrate and method for fabricating},
author = {Li, Ting and Ibbetson, James and Keller, Bernd},
abstractNote = {A method and apparatus for forming a porous layer on the surface of a semiconductor material wherein an electrolyte is provided and is placed in contact with one or more surfaces of a layer of semiconductor material. The electrolyte is heated and a bias is introduced across said electrolyte and the semiconductor material causing a current to flow between the electrolyte and the semiconductor material. The current forms a porous layer on the one or more surfaces of the semiconductor material in contact with the electrolyte. The semiconductor material with its porous layer can serve as a substrate for a light emitter. A semiconductor emission region can be formed on the substrate. The emission region is capable of emitting light omnidirectionally in response to a bias, with the porous layer enhancing extraction of the emitting region light passing through the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {12}
}

Works referenced in this record:

30% external quantum efficiency from surface textured, thin‐film light‐emitting diodes
journal, October 1993


40% efficient thin-film surface-textured light-emitting diodes by optimization of natural lithography
journal, July 2000


Direct observation of porous SiC formed by anodization in HF
journal, May 1993


Blue electroluminescence from porous silicon carbide
journal, December 1994


Surface, Pore Morphology, and Optical Properties of Porous 4H-SiC
journal, January 2001


Impact of texture-enhanced transmission on high-efficiency surface-textured light-emitting diodes
journal, October 2001


Light-extraction mechanisms in high-efficiency surface-textured light-emitting diodes
journal, January 2002


High brightness AlGaInP light-emitting diodes
journal, January 2002