Ceramic substrate including thin film multilayer surface conductor

Wolf, Joseph Ambrose; Peterson, Kenneth A.

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
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Title: Ceramic substrate including thin film multilayer surface conductor

Abstract

A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.

Inventors:: Wolf, Joseph Ambrose; Peterson, Kenneth A.

Issue Date:: Tue May 09 00:00:00 EDT 2017

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1356181

Patent Number(s):: 9648740

Application Number:: 14/502,745

Assignee:: Honeywell Federal Manufacturing & Technologies, LLC

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

Show more

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/115 - {Via connections
H05K2201/0338 - Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
H05K3/4629 - {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}

Show less

DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Resource Relation:: Patent File Date: 2014 Sep 30

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Wolf, Joseph Ambrose, and Peterson, Kenneth A. Ceramic substrate including thin film multilayer surface conductor.  United States: N. p., 2017. 
        Web.

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                    Wolf, Joseph Ambrose, & Peterson, Kenneth A. Ceramic substrate including thin film multilayer surface conductor.  United States.

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                    Wolf, Joseph Ambrose, and Peterson, Kenneth A. Tue .  
        "Ceramic substrate including thin film multilayer surface conductor".  United States.  https://www.osti.gov/servlets/purl/1356181.

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@article{osti_1356181,

  title        = {Ceramic substrate including thin film multilayer surface conductor},

  author       = {Wolf, Joseph Ambrose and Peterson, Kenneth A.},

  abstractNote = {A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue May 09 00:00:00 EDT 2017},

  month        = {Tue May 09 00:00:00 EDT 2017}

}

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Title: Ceramic substrate including thin film multilayer surface conductor

Abstract

Citation Formats

Low Temperature Fired Electrical Components And Method Of Making Same patent, May 1974

Multilayer ceramic substrate with interlayered capacitor patent, January 1986

Method for making chemical laser nozzle arrays patent, May 1988

MLC conductor pattern off-set design to eliminate line to via cracking patent, August 1995

Ceramic substrate and manufacturing method thereof patent, June 1996

High density interconnect substrate and method of manufacturing same patent, February 1999

High k dielectric capacitor with low k sheathed signal vias patent, June 2000

Conductive line features for enhanced reliability of multi-layer ceramic substrates patent, April 2001

Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate patent, June 2002

Transfer material, method for producing the same and wiring substrate produced by using the same patent-application, September 2001

Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same patent-application, October 2001

Multilayer ceramic wiring board and process for producing same patent-application, July 2002

Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part patent-application, July 2002

Equipotential Fault Tolerant Integrated Circuit Heater patent-application, November 2002

Layered board, and apparatus incorporation such layered board patent-application, May 2004

Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device patent-application, July 2004

Electronic package repair process patent-application, August 2004

High-frequency power amplifier patent-application, September 2004

Device for staining and hybridization reactions patent-application, March 2006

Method of producing wire-connection structure, and wire-connection structure patent-application, January 2007

Miniaturized co-fired electrical interconnects for implantable medical devices patent-application, March 2007

Low temperature co-fired ceramic module and method of manufacturing the same patent-application, August 2007

Thick film conductor compositions and the use thereof in LTCC circuits and devices patent-application, October 2007

Multilayered Circuit Board for Connection to Bumps patent-application, May 2009

Electronic Component patent-application, July 2009

Method Of Manufacturing Electronic Device patent-application, July 2009

Wiring Substrate For Electronic-Component Inspection Apparatus patent-application, August 2009

Electrical Inspection Substrate Unit And Manufacturing Method Therefore patent-application, December 2009

Substrate For Mounting Semiconductor Element And Method For Manufacturing Substrate For Mounting Semiconductor Element patent-application, September 2010

Multilayer Printed Wiring Board patent-application, September 2010

Multilayer ceramic board and manufacturing method thereof patent-application, December 2010

Ceramic Substrate, Functional Ceramic Substrate, Probe Card and Method for Manufacturing Ceramic Substrate patent-application, March 2011

High-density wiring multilayered substrate patent, October 1989

Low Temperature Fired Electrical Components And Method Of Making Same
patent, May 1974

Multilayer ceramic substrate with interlayered capacitor
patent, January 1986

Method for making chemical laser nozzle arrays
patent, May 1988

MLC conductor pattern off-set design to eliminate line to via cracking
patent, August 1995

Ceramic substrate and manufacturing method thereof
patent, June 1996

High density interconnect substrate and method of manufacturing same
patent, February 1999

High k dielectric capacitor with low k sheathed signal vias
patent, June 2000

Conductive line features for enhanced reliability of multi-layer ceramic substrates
patent, April 2001

Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
patent, June 2002

Transfer material, method for producing the same and wiring substrate produced by using the same
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Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same
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Multilayer ceramic wiring board and process for producing same
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Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
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Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device
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Method of producing wire-connection structure, and wire-connection structure
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