Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate
Abstract
A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.
- Inventors:
-
- Idaho Falls, ID
- Diamond Bar, CA
- Issue Date:
- Research Org.:
- EG & G IDAHO INC
- OSTI Identifier:
- 870505
- Patent Number(s):
- 5535006
- Assignee:
- Lockheed Idaho Technologies Company (Idaho Falls, ID)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES
- DOE Contract Number:
- AC07-76ID01570
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; evaluating; integrity; adherence; conductor; bond; mating; surface; substrate; impinging; plurality; light; sources; detecting; optical; reflective; signatures; emanating; impinged; determining; location; selected; detected; target; site; optically; imparting; elastic; wave; signature; resulting; step; disclosed; capable; conducting; mating surface; conductor bond; light source; light sources; elastic wave; target site; optical reflective; determining location; evaluating integrity; /356/250/
Citation Formats
Telschow, Kenneth L, and Siu, Bernard K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States: N. p., 1996.
Web.
Telschow, Kenneth L, & Siu, Bernard K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States.
Telschow, Kenneth L, and Siu, Bernard K. Mon .
"Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate". United States. https://www.osti.gov/servlets/purl/870505.
@article{osti_870505,
title = {Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate},
author = {Telschow, Kenneth L and Siu, Bernard K},
abstractNote = {A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}
Works referenced in this record:
Laser ultrasonic monitoring of ceramic sintering
journal, December 1990
- Telschow, K. L.; Walter, J. B.; Garcia, G. V.
- Journal of Applied Physics, Vol. 68, Issue 12