Global to push GA events into
skip to main content

Title: Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate

A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.
Inventors:
 [1];  [2]
  1. (Idaho Falls, ID)
  2. (Diamond Bar, CA)
Issue Date:
OSTI Identifier:
870505
Assignee:
Lockheed Idaho Technologies Company (Idaho Falls, ID) INEEL
Patent Number(s):
US 5535006
Contract Number:
AC07-76ID01570
Research Org:
EG & G IDAHO INC
Country of Publication:
United States
Language:
English
Subject:
method; evaluating; integrity; adherence; conductor; bond; mating; surface; substrate; impinging; plurality; light; sources; detecting; optical; reflective; signatures; emanating; impinged; determining; location; selected; detected; target; site; optically; imparting; elastic; wave; signature; resulting; step; disclosed; capable; conducting; mating surface; conductor bond; light source; light sources; elastic wave; target site; optical reflective; determining location; evaluating integrity; /356/250/

Similar records in DOepatents and OSTI.GOV collections: