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Title: Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate

Abstract

A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.

Inventors:
 [1];  [2]
  1. Idaho Falls, ID
  2. Diamond Bar, CA
Issue Date:
Research Org.:
EG & G IDAHO INC
OSTI Identifier:
870505
Patent Number(s):
5535006
Assignee:
Lockheed Idaho Technologies Company (Idaho Falls, ID)
DOE Contract Number:  
AC07-76ID01570
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; evaluating; integrity; adherence; conductor; bond; mating; surface; substrate; impinging; plurality; light; sources; detecting; optical; reflective; signatures; emanating; impinged; determining; location; selected; detected; target; site; optically; imparting; elastic; wave; signature; resulting; step; disclosed; capable; conducting; mating surface; conductor bond; light source; light sources; elastic wave; target site; optical reflective; determining location; evaluating integrity; /356/250/

Citation Formats

Telschow, Kenneth L, and Siu, Bernard K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States: N. p., 1996. Web.
Telschow, Kenneth L, & Siu, Bernard K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States.
Telschow, Kenneth L, and Siu, Bernard K. Mon . "Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate". United States. https://www.osti.gov/servlets/purl/870505.
@article{osti_870505,
title = {Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate},
author = {Telschow, Kenneth L and Siu, Bernard K},
abstractNote = {A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}

Patent:

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