Direct current sputtering of boron from boron/boron mixtures
Abstract
A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6620836
- Patent Number(s):
- 5372686
- Application Number:
- PPN: US 8-067967
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- DOE Contract Number:
- AC02-76CH03073
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 27 May 1993
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; BORON; VACUUM COATING; ELECTRIC CONDUCTIVITY; SPUTTERING; VACUUM SYSTEMS; DEPOSITION; ELECTRICAL PROPERTIES; ELEMENTS; PHYSICAL PROPERTIES; SEMIMETALS; SURFACE COATING; 360601* - Other Materials- Preparation & Manufacture
Citation Formats
Timberlake, J R, Manos, D, and Nartowitz, E. Direct current sputtering of boron from boron/boron mixtures. United States: N. p., 1994.
Web.
Timberlake, J R, Manos, D, & Nartowitz, E. Direct current sputtering of boron from boron/boron mixtures. United States.
Timberlake, J R, Manos, D, and Nartowitz, E. Tue .
"Direct current sputtering of boron from boron/boron mixtures". United States.
@article{osti_6620836,
title = {Direct current sputtering of boron from boron/boron mixtures},
author = {Timberlake, J R and Manos, D and Nartowitz, E},
abstractNote = {A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 13 00:00:00 EST 1994},
month = {Tue Dec 13 00:00:00 EST 1994}
}
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