Direct current sputtering of boron from boron/coron mixtures

Timberlake, John R; Manos, Dennis; Nartowitz, Ed

Title: Direct current sputtering of boron from boron/coron mixtures

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Abstract

A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod.

Inventors:

Timberlake, John R ^[1]; Manos, Dennis ^[2]; Nartowitz, Ed ^[3]

Allentown, NJ
Williamsburg, VA
Edison, NJ

Issue Date:: 1994-01-01

Research Org.:: Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)

OSTI Identifier:: 869644

Patent Number(s):: 5372686

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Classifications (CPCs):: C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

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C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C14/3421 - {using heated targets}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
Y02E30/10 - Fusion reactors

G - PHYSICS G21 - NUCLEAR PHYSICS G21B - FUSION REACTORS
G21B1/13 - First wall

C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C14/14 - Metallic material, boron or silicon
C23C14/046 - {Coating cavities or hollow spaces, e.g. interior of tubes

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
H01J37/34 - operating with cathodic sputtering

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DOE Contract Number:: AC02-76CH03073

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: direct; current; sputtering; boron; coron; mixtures; method; coating; substrate; lowering; electrical; resistance; boron-containing; rod; allow; conduction; placing; inside; vacuum; chamber; containing; material; coated; applying; potential; target; countering; avalanche; commences; heating; rate; exceeds; cooling; steady; equilibrium; reached; heating rate; cooling rate; electrical potential; substrate material; direct current; vacuum chamber; electrical resistance; chamber containing; target material; heating current; electrical conduction; target mater; containing substrate; current sputtering; /204/

Citation Formats


                    Timberlake, John R, Manos, Dennis, and Nartowitz, Ed. Direct current sputtering of boron from boron/coron mixtures.  United States: N. p., 1994. 
        Web.

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                    Timberlake, John R, Manos, Dennis, & Nartowitz, Ed. Direct current sputtering of boron from boron/coron mixtures.  United States.

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                    Timberlake, John R, Manos, Dennis, and Nartowitz, Ed. Sat .  
        "Direct current sputtering of boron from boron/coron mixtures".  United States.  https://www.osti.gov/servlets/purl/869644.

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@article{osti_869644,

  title        = {Direct current sputtering of boron from boron/coron mixtures},

  author       = {Timberlake, John R and Manos, Dennis and Nartowitz, Ed},

  abstractNote = {A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1994},

  month        = {1}

}

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