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Title: Direct current sputtering of boron from boron/coron mixtures

A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod.
 [1];  [2];  [3]
  1. (Allentown, NJ)
  2. (Williamsburg, VA)
  3. (Edison, NJ)
Issue Date:
OSTI Identifier:
United States of America as represented by United States (Washington, DC) PPPL
Patent Number(s):
US 5372686
Contract Number:
Research Org:
Princeton Plasma Physics Laboratory (PPPL), Princeton, NJ
Country of Publication:
United States
direct; current; sputtering; boron; coron; mixtures; method; coating; substrate; lowering; electrical; resistance; boron-containing; rod; allow; conduction; placing; inside; vacuum; chamber; containing; material; coated; applying; potential; target; countering; avalanche; commences; heating; rate; exceeds; cooling; steady; equilibrium; reached; heating rate; cooling rate; electrical potential; substrate material; direct current; vacuum chamber; electrical resistance; chamber containing; target material; heating current; electrical conduction; target mater; containing substrate; current sputtering; /204/