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Title: Fabrication of boron sputter targets

A process is disclosed for fabricating high density boron sputtering targets with sufficient mechanical strength to function reliably at typical magnetron sputtering power densities and at normal process parameters. The process involves the fabrication of a high density boron monolithe by hot isostatically compacting high purity (99.9%) boron powder, machining the boron monolithe into the final dimensions, and brazing the finished boron piece to a matching boron carbide (B{sub 4}C) piece, by placing aluminum foil there between and applying pressure and heat in a vacuum. An alternative is the application of aluminum metallization to the back of the boron monolithe by vacuum deposition. Also, a titanium based vacuum braze alloy can be used in place of the aluminum foil. 7 figs.
Inventors:
;
Issue Date:
OSTI Identifier:
27725
Assignee:
Univ. Of California, Oakland, CA (United States) PTO; SCA: 360601; PA: EDB-95:058085; SN: 95001354455
Patent Number(s):
US 5,392,981/A/
Application Number:
PAN: 8-161,605
Contract Number:
W-7405-ENG-48
Resource Relation:
Other Information: PBD: 28 Feb 1995
Research Org:
University of California
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; TARGETS; FABRICATION; BORON; SPUTTERING; HOT PRESSING; DEPOSITION

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