Direct current sputtering of boron from boron/carbon mixtures
Patent Application
·
OSTI ID:87304
A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached and coating the substrate material with boron by sputtering from the boron-containing rod.
- Research Organization:
- Princeton Univ., NJ (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC02-76CH03073
- Assignee:
- PPPL; SCA: 700480; 360101; PA: EDB-95:115110; NTS-95:021393; SN: 95001416737
- Patent Number(s):
- PATENTS-US-A8067967
- Application Number:
- ON: DE95015040; PAN: 8-067,967
- OSTI ID:
- 87304
- Resource Relation:
- Other Information: PBD: 1993
- Country of Publication:
- United States
- Language:
- English
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