Direct current sputtering of boron from boron/boron mixtures
Patent
·
OSTI ID:6620836
A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.
- DOE Contract Number:
- AC02-76CH03073
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- US 5372686; A
- Application Number:
- PPN: US 8-067967
- OSTI ID:
- 6620836
- Resource Relation:
- Patent File Date: 27 May 1993
- Country of Publication:
- United States
- Language:
- English
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