DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Patterned nanochannel sacrificial layer for semiconductor substrate reuse

Abstract

Described herein are systems and methods of utilizing nanochannels generated in the sacrificial layer of a semiconductor substrate to increase epitaxial lift-off speeds and facilitate reusability of GaAs substrates. The provided systems and methods may utilize unique nanochannel geometries to increase the surface area exposed to the etchant and further decrease etch times.

Inventors:
; ; ;
Issue Date:
Research Org.:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
2293930
Patent Number(s):
11830733
Application Number:
17/656,762
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/28/2022
Country of Publication:
United States
Language:
English

Citation Formats

Mangum, John Stanley, McMahon, William Edwin, Warren, Emily Lowell, and Theingi, San. Patterned nanochannel sacrificial layer for semiconductor substrate reuse. United States: N. p., 2023. Web.
Mangum, John Stanley, McMahon, William Edwin, Warren, Emily Lowell, & Theingi, San. Patterned nanochannel sacrificial layer for semiconductor substrate reuse. United States.
Mangum, John Stanley, McMahon, William Edwin, Warren, Emily Lowell, and Theingi, San. Tue . "Patterned nanochannel sacrificial layer for semiconductor substrate reuse". United States. https://www.osti.gov/servlets/purl/2293930.
@article{osti_2293930,
title = {Patterned nanochannel sacrificial layer for semiconductor substrate reuse},
author = {Mangum, John Stanley and McMahon, William Edwin and Warren, Emily Lowell and Theingi, San},
abstractNote = {Described herein are systems and methods of utilizing nanochannels generated in the sacrificial layer of a semiconductor substrate to increase epitaxial lift-off speeds and facilitate reusability of GaAs substrates. The provided systems and methods may utilize unique nanochannel geometries to increase the surface area exposed to the etchant and further decrease etch times.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 28 00:00:00 EST 2023},
month = {Tue Nov 28 00:00:00 EST 2023}
}

Works referenced in this record:

Crystal structure and thermal expansion of α‐quartz SiO 2 at low temperatures
journal, October 1982


Multiple release layer study of the intrinsic lateral etch rate of the epitaxial lift-off process
journal, November 2004


High rate epitaxial lift-off of InGaP films from GaAs substrates
journal, April 2000


Epitaxial lift-off process for gallium arsenide substrate reuse and flexible electronics
journal, March 2013


Extreme selectivity in the lift‐off of epitaxial GaAs films
journal, December 1987


GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies
journal, May 2010