Jet impingement manifolds for cooling power electronics modules

Moreno, Gilberto; Narumanchi, Sreekant Venkat; Bennion, Kevin Scott; Kotecha, Ramchandra Mahendrabhai; Paret, Paul Philip; Feng, Xuhui

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A - human necessities
A01 - agriculture
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Title: Jet impingement manifolds for cooling power electronics modules

Abstract

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Inventors:: Moreno, Gilberto; Narumanchi, Sreekant Venkat; Bennion, Kevin Scott; Kotecha, Ramchandra Mahendrabhai; Paret, Paul Philip; Feng, Xuhui

Issue Date:: Tue Sep 05 00:00:00 EDT 2023

Research Org.:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 2222299

Patent Number(s):: 11751365

Application Number:: 17/084,236

Assignee:: Alliance for Sustainable Energy, LLC (Golden, CO)

DOE Contract Number:: AC36-08GO28308

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/29/2020

Country of Publication:: United States

Language:: English

Citation Formats


                    Moreno, Gilberto, Narumanchi, Sreekant Venkat, Bennion, Kevin Scott, Kotecha, Ramchandra Mahendrabhai, Paret, Paul Philip, and Feng, Xuhui. Jet impingement manifolds for cooling power electronics modules.  United States: N. p., 2023. 
        Web.

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                    Moreno, Gilberto, Narumanchi, Sreekant Venkat, Bennion, Kevin Scott, Kotecha, Ramchandra Mahendrabhai, Paret, Paul Philip, & Feng, Xuhui. Jet impingement manifolds for cooling power electronics modules.  United States.

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                    Moreno, Gilberto, Narumanchi, Sreekant Venkat, Bennion, Kevin Scott, Kotecha, Ramchandra Mahendrabhai, Paret, Paul Philip, and Feng, Xuhui. Tue .  
        "Jet impingement manifolds for cooling power electronics modules".  United States.  https://www.osti.gov/servlets/purl/2222299.

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@article{osti_2222299,

  title        = {Jet impingement manifolds for cooling power electronics modules},

  author       = {Moreno, Gilberto and Narumanchi, Sreekant Venkat and Bennion, Kevin Scott and Kotecha, Ramchandra Mahendrabhai and Paret, Paul Philip and Feng, Xuhui},

  abstractNote = {The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Sep 05 00:00:00 EDT 2023},

  month        = {Tue Sep 05 00:00:00 EDT 2023}

}

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Works referenced in this record:

Liquid cooled electronics assembly suitable to use electrically conductive coolant
patent, April 2014

Brandenburg, Scott D.; Parker, Richard D.; Gerbsch, Erich W.
US Patent Document 8,699,225
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8699225

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
patent, March 2007

Bezama, Raschid J.; Colgan, Evan G.; Magerlein, John Harold
US Patent Document 7,190,580
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7190580

Configurable double-sided modular jet impingement assemblies for electronics cooling
patent, May 2018

Zhou, Feng; Dede, Ercan Mehmet
US Patent Document 9,980,415
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9980415

Modular jet impingement assemblies with passive and active flow control for electronics cooling
patent, September 2016

Zhou, Feng; Dede, Ercan Mehmet; Joshi, Shailesh N.
US Patent Document 9,445,526
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9445526

Two-sided jet impingement assemblies and power electronics modules comprising the same
patent, September 2016

Joshi, Shailesh N.; Dede, Ercan Mehmet
US Patent Document 9,437,523
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9437523

Electronic assembly with phase-change cooling of a semiconductor device
patent, April 2019

Roan, Thomas J.; Singh, Brij N.
US Patent Document 10,278,305
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/10278305

Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device
patent-application, September 2005

Kenny, Thomas W.; Munch, Mark; Zhou, Peng
US Patent Application 10/882142; 20050211427
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20050211427

Electronic Assembly with Phase-Change Cooling of a Semiconductor Device
patent-application, September 2018

Roan, Thomas J.; Singh, Brij N.
US Patent Application 15/722,394; 2018/0279508 Al
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20180279508

Methods and systems for heat flux heat removal
patent, April 2019

Eppich, Henry M.; Jacob, Jonah H.
US Patent Document 10,270,220
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/10270220

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Similar Records

Title: Jet impingement manifolds for cooling power electronics modules

Abstract

Citation Formats

Liquid cooled electronics assembly suitable to use electrically conductive coolant patent, April 2014

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages patent, March 2007

Configurable double-sided modular jet impingement assemblies for electronics cooling patent, May 2018

Modular jet impingement assemblies with passive and active flow control for electronics cooling patent, September 2016

Two-sided jet impingement assemblies and power electronics modules comprising the same patent, September 2016

Electronic assembly with phase-change cooling of a semiconductor device patent, April 2019

Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device patent-application, September 2005

Electronic Assembly with Phase-Change Cooling of a Semiconductor Device patent-application, September 2018

Methods and systems for heat flux heat removal patent, April 2019

Liquid cooled electronics assembly suitable to use electrically conductive coolant
patent, April 2014

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
patent, March 2007

Configurable double-sided modular jet impingement assemblies for electronics cooling
patent, May 2018

Modular jet impingement assemblies with passive and active flow control for electronics cooling
patent, September 2016

Two-sided jet impingement assemblies and power electronics modules comprising the same
patent, September 2016

Electronic assembly with phase-change cooling of a semiconductor device
patent, April 2019

Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device
patent-application, September 2005

Electronic Assembly with Phase-Change Cooling of a Semiconductor Device
patent-application, September 2018

Methods and systems for heat flux heat removal
patent, April 2019