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Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

Abstract

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Inventors:
;
Issue Date:
Research Org.:
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440779
Patent Number(s):
9980415
Application Number:
14/831,208
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
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DOE Contract Number:  
EE0006429
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Aug 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Zhou, Feng, and Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling. United States: N. p., 2018. Web.
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Zhou, Feng, & Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling. United States.
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Zhou, Feng, and Dede, Ercan Mehmet. Tue . "Configurable double-sided modular jet impingement assemblies for electronics cooling". United States. https://www.osti.gov/servlets/purl/1440779.
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@article{osti_1440779,
title = {Configurable double-sided modular jet impingement assemblies for electronics cooling},
author = {Zhou, Feng and Dede, Ercan Mehmet},
abstractNote = {A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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Works referenced in this record:

Manifold microchannel heat sink design using optimization under uncertainty
journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds
journal, May 2013

Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model
journal, April 2013

Experimental investigation of heat transfer performance for a novel microchannel heat sink
journal, January 2008

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