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Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

Abstract

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Inventors:
;
Issue Date:
Research Org.:
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440779
Patent Number(s):
9,980,415
Application Number:
14/831,208
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY)
DOE Contract Number:  
EE0006429
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Aug 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Zhou, Feng, and Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling. United States: N. p., 2018. Web.
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Zhou, Feng, & Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling. United States.
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Zhou, Feng, and Dede, Ercan Mehmet. Tue . "Configurable double-sided modular jet impingement assemblies for electronics cooling". United States. https://www.osti.gov/servlets/purl/1440779.
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@article{osti_1440779,
title = {Configurable double-sided modular jet impingement assemblies for electronics cooling},
author = {Zhou, Feng and Dede, Ercan Mehmet},
abstractNote = {A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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Works referenced in this record:

Manifold microchannel heat sink design using optimization under uncertainty
journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds
journal, May 2013

Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model
journal, April 2013

  • Husain, Afzal; Kim, Kwang-Yong
  • IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, Issue 4, p. 617-624
  • DOI: 10.1109/TCPMT.2013.2245943

Experimental investigation of heat transfer performance for a novel microchannel heat sink
journal, January 2008

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