Configurable double-sided modular jet impingement assemblies for electronics cooling

Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Inventors:: Zhou, Feng; Dede, Ercan Mehmet

Issue Date:: 2018-05-22

OSTI Identifier:: 1440779

Assignee:: Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY) DOEEE

Patent Number(s):: 9,980,415

Application Number:: 14/831,208

Contract Number:: EE0006429

Resource Relation:: Patent File Date: 2015 Aug 20

Research Org:: Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

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Other works cited in this record:

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Bezama, Raschid; Colgan, Evan; Magerlein, John
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