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Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.
Inventors:
;
Issue Date:
OSTI Identifier:
1440779
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY) DOEEE
Patent Number(s):
9,980,415
Application Number:
14/831,208
Contract Number:
EE0006429
Resource Relation:
Patent File Date: 2015 Aug 20
Research Org:
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Other works cited in this record:

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
patent, March 2007

Liquid Cooled Rack with Optimized Air Flow Rate and Liquid Coolant Flow
patent-application, February 2010

Manifold microchannel heat sink design using optimization under uncertainty
journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds
journal, May 2013

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