Configurable double-sided modular jet impingement assemblies for electronics cooling

Zhou, Feng; Dede, Ercan Mehmet

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Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

Abstract

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Inventors:: Zhou, Feng; Dede, Ercan Mehmet

Issue Date:: 2018-05-22

Research Org.:: Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1440779

Patent Number(s):: 9980415

Application Number:: 14/831,208

Assignee:: Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/20927 - {Liquid coolant without phase change}

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DOE Contract Number:: EE0006429

Resource Type:: Patent

Resource Relation:: Patent File Date: 2015 Aug 20

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Zhou, Feng, and Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling.  United States: N. p., 2018. 
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                    Zhou, Feng, & Dede, Ercan Mehmet. Configurable double-sided modular jet impingement assemblies for electronics cooling.  United States.

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                    Zhou, Feng, and Dede, Ercan Mehmet. Tue .  
        "Configurable double-sided modular jet impingement assemblies for electronics cooling".  United States.  https://www.osti.gov/servlets/purl/1440779.

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@article{osti_1440779,

  title        = {Configurable double-sided modular jet impingement assemblies for electronics cooling},

  author       = {Zhou, Feng and Dede, Ercan Mehmet},

  abstractNote = {A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2018},

  month        = {5}

}

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Similar Records

Title: Configurable double-sided modular jet impingement assemblies for electronics cooling

Abstract

Citation Formats

Press Plate or the Like and Method of Making the Same patent, October 1933

Forced vaporization heat sink for semiconductor devices patent, May 1981

Cooled stack of electrically isolated semiconductors patent, December 1986

Circuit writer patent, March 1992

Apparatus for cooling semiconductor device and computer having the same patent, April 1995

Method and apparatus for transferring heat, mass, and momentum between a fluid and a surface patent, August 1996

Modular coolant manifold for use with power electronics devices having integrated coolers patent, April 2001

Liquid-cooled power semiconductor device heatsink patent, August 2002

Method and apparatus for controlling a temperature of a microelectronic substrate patent, December 2004

Heat sinks patent, October 2006

Fluid cooled electrical assembly patent, February 2007

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages patent, March 2007

Electroactive polymer devices for controlling fluid flow patent, January 2008

Heat sink with microchannel cooling for power devices patent, April 2008

Power module having self-contained cooling system patent, November 2008

Electroactive polymer devices for controlling fluid flow patent, April 2010

Cooling systems for variable speed drives and inductors patent, January 2011

Intelligent cooling method combining passive and active cooling components patent, February 2011

Integral heat sink with spiral manifolds patent, February 2012

System and method for facilitating parallel cooling of liquid-cooled electronics racks patent, June 2012

Reactor with upper and lower manifold structures patent, September 2012

Double side cooled power module with power overlay patent, January 2013

Cooling member patent, July 2013

Flow boiling heat sink structure with vapor venting and condensing patent, October 2013

Heat sink patent, December 2013

Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections patent, February 2014

Semiconductor module patent, August 2014

High performance liquid cooled heatsink for IGBT modules patent, November 2014

Multichannel heat exchanger with dissimilar flow patent, January 2015

System and method for cooling heat generating components patent, May 2015

Integrated heat exchanger and power delivery system for high powered electronic modules patent, January 2017

Cooling system for burn-in unit patent-application, June 2002

Heat exchanger with internal slotted manifold patent-application, July 2003

Micro-electromechanical valve assembly patent-application, May 2004

Radiator Plate Rapid Cooling Apparatus patent-application, November 2005

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins patent-application, November 2006

Flow Analysis Apparatus and Method patent-application, September 2008

Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Employing a Manifold Structure with Interleaved Coolant Inlet and Outlet Passageways patent-application, October 2008

Heat exchanger assembly patent-application, November 2008

Electronically Controlled Capsule patent-application, December 2009

Liquid Cooled Rack with Optimized Air Flow Rate and Liquid Coolant Flow patent-application, February 2010

Heat Exchanger for Electronic Assemblies patent-application, June 2012

Fluid Heat Exchange Systems patent-application, June 2012

Multichannel Heat Exchanger with Dissimilar Flow patent-application, October 2012

Cooling Device for a Power Module, and a Related Method Thereof patent-application, December 2012

Valve Operated By Its Own Medium patent-application, February 2013

Macro-Channel Water-Cooled Heat-Sink for Diode-Laser Bars patent-application, May 2014

Artificial Muscle Camera Lens Actuator patent-application, June 2014

Disassemblable Electronic Assembly With Leak-Inhibiting Coolant Capillaries patent-application, July 2014

Method and Structure of a Microchannel Heat Sink Device for Micro-Gap Thermophotovoltaic Electrical Energy Generation patent-application, September 2014

System and Method for Cooling Heat Generating Components patent-application, September 2014

Fabricating Separable and Integrated Heat Sinks Facilitating Cooling Multi-Component Electronic Assembly patent-application, March 2015

Injection Molding Machines and Methods for Accounting for Changes in Material Properties During Injection Molding Runs patent-application, April 2015

Two-Sided Jet Impingement Assemblies and Power Electronics Modules Comprising the Same patent-application, December 2015

Flexible Coolant Manifold - Heat Sink Assembly patent-application, August 2016

Manifold microchannel heat sink design using optimization under uncertainty journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds journal, May 2013

Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model journal, April 2013

Experimental investigation of heat transfer performance for a novel microchannel heat sink journal, January 2008

Press Plate or the Like and Method of Making the Same
patent, October 1933

Forced vaporization heat sink for semiconductor devices
patent, May 1981

Cooled stack of electrically isolated semiconductors
patent, December 1986

Circuit writer
patent, March 1992

Apparatus for cooling semiconductor device and computer having the same
patent, April 1995

Method and apparatus for transferring heat, mass, and momentum between a fluid and a surface
patent, August 1996

Modular coolant manifold for use with power electronics devices having integrated coolers
patent, April 2001

Liquid-cooled power semiconductor device heatsink
patent, August 2002

Method and apparatus for controlling a temperature of a microelectronic substrate
patent, December 2004

Heat sinks
patent, October 2006

Fluid cooled electrical assembly
patent, February 2007

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
patent, March 2007

Electroactive polymer devices for controlling fluid flow
patent, January 2008

Heat sink with microchannel cooling for power devices
patent, April 2008

Power module having self-contained cooling system
patent, November 2008

Electroactive polymer devices for controlling fluid flow
patent, April 2010

Cooling systems for variable speed drives and inductors
patent, January 2011

Intelligent cooling method combining passive and active cooling components
patent, February 2011

Integral heat sink with spiral manifolds
patent, February 2012

System and method for facilitating parallel cooling of liquid-cooled electronics racks
patent, June 2012

Reactor with upper and lower manifold structures
patent, September 2012

Double side cooled power module with power overlay
patent, January 2013

Cooling member
patent, July 2013

Flow boiling heat sink structure with vapor venting and condensing
patent, October 2013

Heat sink
patent, December 2013

Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
patent, February 2014

Semiconductor module
patent, August 2014

High performance liquid cooled heatsink for IGBT modules
patent, November 2014

Multichannel heat exchanger with dissimilar flow
patent, January 2015

System and method for cooling heat generating components
patent, May 2015

Integrated heat exchanger and power delivery system for high powered electronic modules
patent, January 2017

Cooling system for burn-in unit
patent-application, June 2002

Heat exchanger with internal slotted manifold
patent-application, July 2003

Micro-electromechanical valve assembly
patent-application, May 2004

Radiator Plate Rapid Cooling Apparatus
patent-application, November 2005

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
patent-application, November 2006

Flow Analysis Apparatus and Method
patent-application, September 2008

Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Employing a Manifold Structure with Interleaved Coolant Inlet and Outlet Passageways
patent-application, October 2008

Heat exchanger assembly
patent-application, November 2008

Electronically Controlled Capsule
patent-application, December 2009

Liquid Cooled Rack with Optimized Air Flow Rate and Liquid Coolant Flow
patent-application, February 2010

Heat Exchanger for Electronic Assemblies
patent-application, June 2012

Fluid Heat Exchange Systems
patent-application, June 2012

Multichannel Heat Exchanger with Dissimilar Flow
patent-application, October 2012

Cooling Device for a Power Module, and a Related Method Thereof
patent-application, December 2012

Valve Operated By Its Own Medium
patent-application, February 2013

Macro-Channel Water-Cooled Heat-Sink for Diode-Laser Bars
patent-application, May 2014

Artificial Muscle Camera Lens Actuator
patent-application, June 2014

Disassemblable Electronic Assembly With Leak-Inhibiting Coolant Capillaries
patent-application, July 2014

Method and Structure of a Microchannel Heat Sink Device for Micro-Gap Thermophotovoltaic Electrical Energy Generation
patent-application, September 2014

System and Method for Cooling Heat Generating Components
patent-application, September 2014

Fabricating Separable and Integrated Heat Sinks Facilitating Cooling Multi-Component Electronic Assembly
patent-application, March 2015

Injection Molding Machines and Methods for Accounting for Changes in Material Properties During Injection Molding Runs
patent-application, April 2015

Two-Sided Jet Impingement Assemblies and Power Electronics Modules Comprising the Same
patent-application, December 2015

Flexible Coolant Manifold - Heat Sink Assembly
patent-application, August 2016

Manifold microchannel heat sink design using optimization under uncertainty
journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds
journal, May 2013

Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model
journal, April 2013

Experimental investigation of heat transfer performance for a novel microchannel heat sink
journal, January 2008