Inverter power module with distributed support for direct substrate cooling

Miller, David Harold; Korich, Mark D; Ward, Terence G; Mann, Brooks S

Title: Inverter power module with distributed support for direct substrate cooling

Abstract

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Inventors:

Miller, David Harold ^[1]; Korich, Mark D ^[2]; Ward, Terence G ^[3]; Mann, Brooks S ^[3]

San Pedro, CA
Chino Hills, CA
Redondo Beach, CA

Issue Date:: 2012-08-21

Research Org.:: National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1062377

Patent Number(s):: 8248809

Assignee:: GM Global Technology Operations LLC (Detroit, MI)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Show more

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L25/072 - {the devices being arranged next to each other}
H01L2924/207 - Diameter ranges
H01L23/4735 - {Jet impingement
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2224/48139 - with an intermediate bond, e.g. continuous wire daisy chain
H01L24/49 - {of a plurality of wire connectors}
H01L2924/181 - Encapsulation
H01L2224/49175 - Parallel arrangements
H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/53122 - including deforming means

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2224/48095 - Kinked
H01L2224/4809 - Loop shape
H01L2924/1305 - Bipolar Junction Transistor [BJT]
H01L2224/45015 - being circular
H01L2224/48137 - the bodies being arranged next to each other, e.g. on a common substrate
H01L2224/45099 - Material
H01L2924/13055 - Insulated gate bipolar transistor [IGBT]
H01L23/3735 - {Laminates or multilayers, e.g. direct bond copper ceramic substrates}
H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
H01L2224/49111 - the connectors connecting two common bonding areas, e.g. Litz or braid wires
H01L24/48 - {of an individual wire connector}

Show less

DOE Contract Number:: FC26-07NT43123

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 47 OTHER INSTRUMENTATION

Citation Formats


                    Miller, David Harold, Korich, Mark D, Ward, Terence G, and Mann, Brooks S. Inverter power module with distributed support for direct substrate cooling.  United States: N. p., 2012. 
        Web.

Copy to clipboard


                    Miller, David Harold, Korich, Mark D, Ward, Terence G, & Mann, Brooks S. Inverter power module with distributed support for direct substrate cooling.  United States.

Copy to clipboard


                    Miller, David Harold, Korich, Mark D, Ward, Terence G, and Mann, Brooks S. Tue .  
        "Inverter power module with distributed support for direct substrate cooling".  United States.  https://www.osti.gov/servlets/purl/1062377.

Copy to clipboard


                    
@article{osti_1062377,

  title        = {Inverter power module with distributed support for direct substrate cooling},

  author       = {Miller, David Harold and Korich, Mark D and Ward, Terence G and Mann, Brooks S},

  abstractNote = {Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2012},

  month        = {8}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000

Beitelmal, Abdlmonem H.; Saad, Michel A.; Patel, Chandrakant D.
International Communications in Heat and Mass Transfer, Vol. 27, Issue 1
https://doi.org/10.1016/S0735-1933(00)00079-8

Similar Records in DOE Patents and OSTI.GOV collections:

Power electronics substrate for direct substrate cooling

Patent Le, Khiet [Mission Viejo, CA]; Ward, Terence G [Redondo Beach, CA]; Mann, Brooks S [Redondo Beach, CA]; ...

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
Full Text Available
Direct cooled power electronics substrate

Patent Wiles, Randy H [Powell, TN]; Wereszczak, Andrew A [Oak Ridge, TN]; Ayers, Curtis W [Kingston, TN]; ...

The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit insidemore »« less
Full Text Available
Electrical power inverter having a phase modulated, twin-inverter, high frequency link and an energy storage module

Patent Pitel, Ira J [Whippany, NJ]

The present invention provides an electrical power inverter method and apparatus, which includes a high frequency link, for converting DC power into AC power. Generally stated, the apparatus includes a first high frequency module which produces an AC voltage at a first output frequency, and a second high frequency inverter module which produces an AC voltage at a second output frequency that is substantially the same as the first output frequency. The second AC voltage is out of phase with the first AC voltage by a selected angular phase displacement. A mixer mixes the first and second output voltages tomore »« less
Full Text Available
Electrical system for pulse-width modulated control of a power inverter using phase-shifted carrier signals and related operating methods

Patent Welchko, Brian A [Torrance, CA]

Systems and methods are provided for pulse-width modulated control of power inverter using phase-shifted carrier signals. An electrical system comprises an energy source and a motor. The motor has a first set of windings and a second set of windings, which are electrically isolated from each other. An inverter module is coupled between the energy source and the motor and comprises a first set of phase legs coupled to the first set of windings and a second set of phase legs coupled to the second set of windings. A controller is coupled to the inverter module and is configured tomore »« less
Full Text Available
Power inverter module with reduced inductance

Patent Jaksic, Marko; Patwardhan, Ajay V.; Stancu, Constantin C.; ...

A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At leastmore »« less
Full Text Available

Similar Records

Title: Inverter power module with distributed support for direct substrate cooling

Abstract

Citation Formats

Effects of surface roughness on the average heat transfer of an impinging air jet journal, January 2000

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000