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Title: Inverter power module with distributed support for direct substrate cooling

Abstract

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Inventors:
 [1];  [2];  [3];  [3]
  1. San Pedro, CA
  2. Chino Hills, CA
  3. Redondo Beach, CA
Issue Date:
Research Org.:
National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1062377
Patent Number(s):
8248809
Assignee:
GM Global Technology Operations LLC (Detroit, MI)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
FC26-07NT43123
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Miller, David Harold, Korich, Mark D, Ward, Terence G, and Mann, Brooks S. Inverter power module with distributed support for direct substrate cooling. United States: N. p., 2012. Web.
Miller, David Harold, Korich, Mark D, Ward, Terence G, & Mann, Brooks S. Inverter power module with distributed support for direct substrate cooling. United States.
Miller, David Harold, Korich, Mark D, Ward, Terence G, and Mann, Brooks S. Tue . "Inverter power module with distributed support for direct substrate cooling". United States. https://www.osti.gov/servlets/purl/1062377.
@article{osti_1062377,
title = {Inverter power module with distributed support for direct substrate cooling},
author = {Miller, David Harold and Korich, Mark D and Ward, Terence G and Mann, Brooks S},
abstractNote = {Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {8}
}

Works referenced in this record:

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000