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Title: Integrated three-dimensional module heat exchanger for power electronics cooling

Abstract

Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.

Inventors:
;
Issue Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1096006
Patent Number(s):
8,541,875
Application Number:
13/249,706
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO) NREL
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Bennion, Kevin, and Lustbader, Jason. Integrated three-dimensional module heat exchanger for power electronics cooling. United States: N. p., 2013. Web.
Bennion, Kevin, & Lustbader, Jason. Integrated three-dimensional module heat exchanger for power electronics cooling. United States.
Bennion, Kevin, and Lustbader, Jason. Tue . "Integrated three-dimensional module heat exchanger for power electronics cooling". United States. https://www.osti.gov/servlets/purl/1096006.
@article{osti_1096006,
title = {Integrated three-dimensional module heat exchanger for power electronics cooling},
author = {Bennion, Kevin and Lustbader, Jason},
abstractNote = {Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {9}
}

Patent:

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