Modular jet impingement assemblies with passive and active flow control for electronics cooling
Abstract
Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.
- Inventors:
- Issue Date:
- Research Org.:
- Toyota Motor Engineering & Manufacturing North America, Inc. Erlanger, KY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1324402
- Patent Number(s):
- 9,445,526
- Application Number:
- 14/578,906
- Assignee:
- Toyota Motor Engineering & Manufacturing North America, Inc.
- DOE Contract Number:
- EE0006429
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Dec 22
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Zhou, Feng, Dede, Ercan Mehmet, and Joshi, Shailesh. Modular jet impingement assemblies with passive and active flow control for electronics cooling. United States: N. p., 2016.
Web.
Zhou, Feng, Dede, Ercan Mehmet, & Joshi, Shailesh. Modular jet impingement assemblies with passive and active flow control for electronics cooling. United States.
Zhou, Feng, Dede, Ercan Mehmet, and Joshi, Shailesh. Tue .
"Modular jet impingement assemblies with passive and active flow control for electronics cooling". United States. https://www.osti.gov/servlets/purl/1324402.
@article{osti_1324402,
title = {Modular jet impingement assemblies with passive and active flow control for electronics cooling},
author = {Zhou, Feng and Dede, Ercan Mehmet and Joshi, Shailesh},
abstractNote = {Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {9}
}
Works referenced in this record:
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Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model
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