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Title: Modular jet impingement assemblies with passive and active flow control for electronics cooling

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1324402
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. DOEEE
Patent Number(s):
9,445,526
Application Number:
14/578,906
Contract Number:
EE0006429
Resource Relation:
Patent File Date: 2014 Dec 22
Research Org:
Toyota Motor Engineering & Manufacturing North America, Inc. Erlanger, KY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Other works cited in this record:

Manifold microchannel heat sink design using optimization under uncertainty
journal, February 2014

Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds
journal, May 2013

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