Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Anderson, Iver E.; Reeve, Kathlene Nicole

Title: Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Abstract

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Inventors:: Anderson, Iver E.; Reeve, Kathlene Nicole

Issue Date:: 2020-04-21

Research Org.:: Ames Laboratory (AMES), Ames, IA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1650785

Patent Number(s):: 10625378

Application Number:: 13/999,284

Assignee:: Iowa State University Research Foundation, Inc. (Ames, IA)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS

Show more

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K35/001 - {Interlayers, transition pieces for metallurgical bonding of workpieces}
B23K35/0222 - {for use in soldering, brazing
B23K35/0244 - {Powders, particles or spheres
B23K35/025 - {Pastes, creams, slurries}
B23K35/26 - with the principal constituent melting at less than 400 degrees C
B23K35/262 - {Sn as the principal constituent}
B23K35/286 - {Al as the principal constituent}
B23K35/30 - with the principal constituent melting at less than 1550 degrees C
B23K35/302 - {Cu as the principal constituent}
B23K35/38 - Selection of media, e.g. special atmospheres for surrounding the working area
B23K35/383 - {mainly containing noble gases or nitrogen}

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS
C22C13/00 - Alloys based on tin

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2203/1121 - Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
H05K3/3463 - {Solder compositions in relation to features of the printed circuit board or the mounting process}

Show less

DOE Contract Number:: AC02-07CH11358

Resource Type:: Patent

Resource Relation:: Patent File Date: 02/06/2014

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Anderson, Iver E., and Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder.  United States: N. p., 2020. 
        Web.

Copy to clipboard


                    Anderson, Iver E., & Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder.  United States.

Copy to clipboard


                    Anderson, Iver E., and Reeve, Kathlene Nicole. Tue .  
        "Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder".  United States.  https://www.osti.gov/servlets/purl/1650785.

Copy to clipboard


                    
@article{osti_1650785,

  title        = {Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder},

  author       = {Anderson, Iver E. and Reeve, Kathlene Nicole},

  abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2020},

  month        = {4}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

PB-Free SN-AG-CU-MN Solder
patent-application, August 2010

Anderson, Iver E.; Harringa, Joel; Walleser, Jason K.
US Patent Application 12/456853; 20100203353
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100203353

Lead-Free Solder
patent-application, December 2004

Amagai, Masazumi; Watanabe, Masako; Murata, Kensho
US Patent Application 10/824647; 20040262779
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040262779

Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996

Anderson, Iver E.; Yost, Frederick G.; Smith, John F.
US Patent Document 5,527,628
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5527628

Methods for Producing Lead-Free In-Situ Composite Solder Alloys
patent-application, June 2004

Bieler, Thomas R.; Subramanian, K. N.; Choi, Sunglak
US Patent Application 10/730398; 20040112478
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040112478

Atomizing nozzle and process
patent, June 1992

Anderson, Iver E.; Figliola, Richard S.; Molnar, Holly M.
US Patent Document 5,125,574
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5125574

Atomizing nozzle and method
patent, November 2000

Ting, Jason; Anderson, Iver E.; Terpstra, Robert L.
US Patent Document 6,142,382
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6142382

Atomizing nozzle and process
patent, July 1993

Anderson, Iver E.; Figliola, Richard S.; Molnar, Holly M.
US Patent Document 5,228,620
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5228620

Similar Records in DOE Patents and OSTI.GOV collections:

Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Patent Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
Full Text Available
Pb-free Sn-Ag-Cu ternary eutectic solder

Patent Anderson, Iver E [Ames, IA]; Yost, Frederick G [Cedar Crest, NM]; Smith, John F [Ames, IA]; ...

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).
Full Text Available
Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Journal Article Reeve, Kathlene N. [Purdue Univ., West Lafayette, IN (United States)]; Choquette, Stephanie M. [Ames Lab. and Iowa State Univ., Ames, IA (United States)]; Anderson, Iver E. [Ames Lab. and Iowa State Univ., Ames, IA (United States)]; ... - Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science

Particles of Cu _x Al _y in Sn-Cu-Al solders have previously been shown to nucleate the Cu₆Sn₅ phase during solidification. In this study, the number and size of Cu₆Sn₅ nucleation sites were controlled through the particle size refinement of Cu _x Al _y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu _x Al _y and Cu₆Sn₅ particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy compositionmore » « less
Cited by 2
DOI: https://doi.org/10.1007/s11661-016-3738-6

Full Text Available
Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Journal Article Reeve, Kathlene N. [Purdue Univ., West Lafayette, IN (United States)]; Choquette, Stephanie M. [Ames Lab. and Iowa State Univ., Ames, IA (United States)]; Anderson, Iver E. [Ames Lab. and Iowa State Univ., Ames, IA (United States)]; ... - Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu _x Al _y and Cu₆Sn₅ in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °Cmore » « less
Cited by 3
DOI: https://doi.org/10.1007/s11661-016-3739-5

Full Text Available
Pb-free Sn-Ag-Cu ternary eutectic solder

Patent Anderson, I E; Yost, F G; Smith, J F; ...

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

Similar Records

Title: Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Abstract

Citation Formats

PB-Free SN-AG-CU-MN Solder patent-application, August 2010

Lead-Free Solder patent-application, December 2004

Pb-free Sn-Ag-Cu ternary eutectic solder patent, June 1996

Methods for Producing Lead-Free In-Situ Composite Solder Alloys patent-application, June 2004

Atomizing nozzle and process patent, June 1992

Atomizing nozzle and method patent, November 2000

Atomizing nozzle and process patent, July 1993

PB-Free SN-AG-CU-MN Solder
patent-application, August 2010

Lead-Free Solder
patent-application, December 2004

Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996

Methods for Producing Lead-Free In-Situ Composite Solder Alloys
patent-application, June 2004

Atomizing nozzle and process
patent, June 1992

Atomizing nozzle and method
patent, November 2000

Atomizing nozzle and process
patent, July 1993