Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
Abstract
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
- Inventors:
- Issue Date:
- Research Org.:
- Ames Laboratory (AMES), Ames, IA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1650785
- Patent Number(s):
- 10625378
- Application Number:
- 13/999,284
- Assignee:
- Iowa State University Research Foundation, Inc. (Ames, IA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS
- DOE Contract Number:
- AC02-07CH11358
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 02/06/2014
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Anderson, Iver E., and Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder. United States: N. p., 2020.
Web.
Anderson, Iver E., & Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder. United States.
Anderson, Iver E., and Reeve, Kathlene Nicole. Tue .
"Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder". United States. https://www.osti.gov/servlets/purl/1650785.
@article{osti_1650785,
title = {Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder},
author = {Anderson, Iver E. and Reeve, Kathlene Nicole},
abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 21 00:00:00 EDT 2020},
month = {Tue Apr 21 00:00:00 EDT 2020}
}
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Works referenced in this record:
PB-Free SN-AG-CU-MN Solder
patent-application, August 2010
- Anderson, Iver E.; Harringa, Joel; Walleser, Jason K.
- US Patent Application 12/456853; 20100203353
Lead-Free Solder
patent-application, December 2004
- Amagai, Masazumi; Watanabe, Masako; Murata, Kensho
- US Patent Application 10/824647; 20040262779
Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996
- Anderson, Iver E.; Yost, Frederick G.; Smith, John F.
- US Patent Document 5,527,628
Methods for Producing Lead-Free In-Situ Composite Solder Alloys
patent-application, June 2004
- Bieler, Thomas R.; Subramanian, K. N.; Choi, Sunglak
- US Patent Application 10/730398; 20040112478
Atomizing nozzle and process
patent, June 1992
- Anderson, Iver E.; Figliola, Richard S.; Molnar, Holly M.
- US Patent Document 5,125,574
Atomizing nozzle and method
patent, November 2000
- Ting, Jason; Anderson, Iver E.; Terpstra, Robert L.
- US Patent Document 6,142,382
Atomizing nozzle and process
patent, July 1993
- Anderson, Iver E.; Figliola, Richard S.; Molnar, Holly M.
- US Patent Document 5,228,620