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Title: Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Abstract

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Inventors:
;
Issue Date:
Research Org.:
Ames Lab., Ames, IA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1650785
Patent Number(s):
10625378
Application Number:
13/999,284
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
AC02-07CH11358
Resource Type:
Patent
Resource Relation:
Patent File Date: 02/06/2014
Country of Publication:
United States
Language:
English

Citation Formats

Anderson, Iver E., and Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder. United States: N. p., 2020. Web.
Anderson, Iver E., & Reeve, Kathlene Nicole. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder. United States.
Anderson, Iver E., and Reeve, Kathlene Nicole. Tue . "Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder". United States. https://www.osti.gov/servlets/purl/1650785.
@article{osti_1650785,
title = {Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder},
author = {Anderson, Iver E. and Reeve, Kathlene Nicole},
abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {4}
}

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Works referenced in this record:

Atomizing nozzle and method
patent, November 2000


Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996


Atomizing nozzle and process
patent, July 1993


Atomizing nozzle and process
patent, June 1992