Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

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Title: Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Abstract

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Inventors:: Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

Issue Date:: 2019-10-15

Research Org.:: Ames Laboratory (AMES), Ames, IA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600142

Patent Number(s):: 10442037

Application Number:: 14/544,833

Assignee:: Iowa State University Research Foundation, Inc. (Ames, IA)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS

Show more

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K35/001 - {Interlayers, transition pieces for metallurgical bonding of workpieces}
B23K35/0244 - {Powders, particles or spheres
B23K35/262 - {Sn as the principal constituent}

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS
C22C13/00 - Alloys based on tin

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/3463 - {Solder compositions in relation to features of the printed circuit board or the mounting process}

Show less

DOE Contract Number:: AC02-07CH11358

Resource Type:: Patent

Resource Relation:: Patent File Date: 02/24/2015

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder.  United States: N. p., 2019. 
        Web.

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                    Anderson, Iver E., Harringa, Joel L., & Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder.  United States.

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                    Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Tue .  
        "Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder".  United States.  https://www.osti.gov/servlets/purl/1600142.

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@article{osti_1600142,

  title        = {Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder},

  author       = {Anderson, Iver E. and Harringa, Joel L. and Boesenberg, Adam J.},

  abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {10}

}

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Works referenced in this record:

Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties
journal, September 2007

Song, Jenn-Ming; Lin, Jian-Jhih; Huang, Chi-Feng
Materials Science and Engineering: A, Vol. 466, Issue 1-2
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Lead-free solder
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Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
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Anderson, Iver E.
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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
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Swenson, D.
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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
journal, March 2003

Kim, K. S.; Huh, S. H.; Suganuma, K.
Journal of Alloys and Compounds, Vol. 352, Issue 1-2
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Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design
journal, September 2009

Anderson, Iver E.; Walleser, Jason W.; Harringa, Joel L.
Journal of Electronic Materials, Vol. 38, Issue 12
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Lead-free solder
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The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
conference, December 2008

Liu, Weiping; Bachorik, Paul; Lee, Ning-Cheng
2008 10th Electronics Packaging Technology Conference
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Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects
journal, June 2007

De Monlevade, Eduardo Franco; Peng, Weiqun
Journal of Electronic Materials, Vol. 36, Issue 7
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Lead-free tin-silver-copper alloy solder composition
patent, October 2004

Choi, Won Kook; Goldsmith, Charles C.; Gosselin, Timothy A.
US Patent Document 6,805,974
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The Effect of Small Additives on the Undercooling of Pure Tin [溶融錫の過冷におよぼす微量添加元素の影響]
journal, January 1973

Ohno, Atsumi; Motegi, Tetsuichi
Journal of the Japan Institute of Metals, Vol. 37, Issue 7
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Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
journal, October 2000

Moon, K. -W.; Boettinger, W. J.; Kattner, U. R.
Journal of Electronic Materials, Vol. 29, Issue 10
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Process for forming a protective film on Cu-Sn alloys
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Brock, Andrew J.; Mandigo, Frank N.
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Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996

Anderson, Iver E.; Yost, Frederick G.; Smith, John F.
US Patent Document 5,527,628
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Britannia Metal of Pewter Alloy
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Konigsberg, Joseph H.
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Application of an asymmetrical four point bend shear test to solder joints
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Unal, Ö.; Anderson, I. E.; Harringa, J. L.
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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
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Kang, S. K.; Lauro, P.; Shih, D. -Y.
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Alloying modification of Sn–Ag–Cu solders by manganese and titanium
journal, March 2009

Lin, Li-Wei; Song, Jenn-Ming; Lai, Yi-Shao
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Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
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Kang, Sung K.; Cho, M. G.; Lauro, P.
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Physics and materials challenges for lead-free solders
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Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
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Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
journal, September 2001

Anderson, I. E.; Foley, J. C.; Cook, B. A.
Journal of Electronic Materials, Vol. 30, Issue 9
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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
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Anderson, I. E.; Harringa, J. L.
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The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
journal, July 2007

Liu, Weiping; Lee, Ning-Cheng
JOM, Vol. 59, Issue 7
https://doi.org/10.1007/s11837-007-0085-5

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints
journal, July 2007

Anderson, I. E.; Walleser, J.; Harringa, J. L.
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Similar Records

Title: Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Abstract

Citation Formats

Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties journal, September 2007

Lead-free solder patent, October 2007

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications journal, September 2006

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints journal, September 2006

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints journal, March 2003

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design journal, September 2009

Lead-free solder patent, May 2001

The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism conference, December 2008

Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects journal, June 2007

Lead-free tin-silver-copper alloy solder composition patent, October 2004

The Effect of Small Additives on the Undercooling of Pure Tin [溶融錫の過冷におよぼす微量添加元素の影響] journal, January 1973

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys journal, October 2000

Process for forming a protective film on Cu-Sn alloys patent, April 1984

Pb-free Sn-Ag-Cu ternary eutectic solder patent, June 1996

Britannia Metal of Pewter Alloy patent, August 1932

Application of an asymmetrical four point bend shear test to solder joints journal, September 2001

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications journal, July 2005

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu journal, June 2003

Alloying modification of Sn–Ag–Cu solders by manganese and titanium journal, March 2009

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process journal, March 2007

Physics and materials challenges for lead-free solders journal, February 2003

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders journal, March 2005

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability journal, September 2001

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints journal, January 2006

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints journal, July 2007

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints journal, July 2007

Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties
journal, September 2007

Lead-free solder
patent, October 2007

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
journal, September 2006

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
journal, September 2006

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
journal, March 2003

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design
journal, September 2009

Lead-free solder
patent, May 2001

The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
conference, December 2008

Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects
journal, June 2007

Lead-free tin-silver-copper alloy solder composition
patent, October 2004

The Effect of Small Additives on the Undercooling of Pure Tin [溶融錫の過冷におよぼす微量添加元素の影響]
journal, January 1973

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
journal, October 2000

Process for forming a protective film on Cu-Sn alloys
patent, April 1984

Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996

Britannia Metal of Pewter Alloy
patent, August 1932

Application of an asymmetrical four point bend shear test to solder joints
journal, September 2001

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
journal, July 2005

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
journal, June 2003

Alloying modification of Sn–Ag–Cu solders by manganese and titanium
journal, March 2009

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
journal, March 2007

Physics and materials challenges for lead-free solders
journal, February 2003

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
journal, March 2005

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
journal, September 2001

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
journal, January 2006

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
journal, July 2007

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints
journal, July 2007