Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder
Abstract
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
- Inventors:
- Issue Date:
- Research Org.:
- Ames Lab., Ames, IA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600142
- Patent Number(s):
- 10442037
- Application Number:
- 14/544,833
- Assignee:
- Iowa State University Research Foundation, Inc. (Ames, IA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC02-07CH11358
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 02/24/2015
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder. United States: N. p., 2019.
Web.
Anderson, Iver E., Harringa, Joel L., & Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder. United States.
Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Tue .
"Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder". United States. https://www.osti.gov/servlets/purl/1600142.
@article{osti_1600142,
title = {Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder},
author = {Anderson, Iver E. and Harringa, Joel L. and Boesenberg, Adam J.},
abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Lead-free solder
patent, May 2001
- Anderson, Iver E.; Terpstra, Robert L.
- US Patent Document 6,231,691
Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996
- Anderson, Iver E.; Yost, Frederick G.; Smith, John F.
- US Patent Document 5,527,628
Lead-free tin-silver-copper alloy solder composition
patent, October 2004
- Choi, Won K.; Goldsmith, Charles C.; Gosselin, Timothy A.
- US Patent Document 6,805,974
Lead-free solder
patent, October 2007
- Amagai, Masazumi; Watanabe, Masako; Murata, Kensho
- US Patent Document 7,282,175
Process for forming a protective film on Cu-Sn alloys
patent, April 1984
- Brock, Andrew J.; Mandigo, Frank N.
- US Patent Document 4,443,274