Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

Title: Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Abstract

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Inventors:: Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

Issue Date:: 2019-10-15

Research Org.:: Ames Lab., Ames, IA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600142

Patent Number(s):: 10442037

Application Number:: 14/544,833

Assignee:: Iowa State University Research Foundation, Inc. (Ames, IA)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K35/001 - {Interlayers, transition pieces for metallurgical bonding of workpieces}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/3463 - {Solder compositions in relation to features of the printed circuit board or the mounting process}

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K35/262 - {Sn as the principal constituent}
B23K35/0244 - {Powders, particles or spheres

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS
C22C13/00 - Alloys based on tin

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DOE Contract Number:: AC02-07CH11358

Resource Type:: Patent

Resource Relation:: Patent File Date: 02/24/2015

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder.  United States: N. p., 2019. 
        Web.

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                    Anderson, Iver E., Harringa, Joel L., & Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder.  United States.

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                    Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Tue .  
        "Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder".  United States.  https://www.osti.gov/servlets/purl/1600142.

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@article{osti_1600142,

  title        = {Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder},

  author       = {Anderson, Iver E. and Harringa, Joel L. and Boesenberg, Adam J.},

  abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {10}

}

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Works referenced in this record:

Lead-free solder
patent, May 2001

Anderson, Iver E.; Terpstra, Robert L.
US Patent Document 6,231,691
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6231691

Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996

Anderson, Iver E.; Yost, Frederick G.; Smith, John F.
US Patent Document 5,527,628
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5527628

Lead-free tin-silver-copper alloy solder composition
patent, October 2004

Choi, Won K.; Goldsmith, Charles C.; Gosselin, Timothy A.
US Patent Document 6,805,974
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6805974

Lead-free solder
patent, October 2007

Amagai, Masazumi; Watanabe, Masako; Murata, Kensho
US Patent Document 7,282,175
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7282175

Process for forming a protective film on Cu-Sn alloys
patent, April 1984

Brock, Andrew J.; Mandigo, Frank N.
US Patent Document 4,443,274
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=4443274

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Title: Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Abstract

Citation Formats

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