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Title: Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Abstract

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Inventors:
; ;
Issue Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600142
Patent Number(s):
10,442,037
Application Number:
14/544,833
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
DOE Contract Number:  
AC02-07CH11358
Resource Type:
Patent
Resource Relation:
Patent File Date: 02/24/2015
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder. United States: N. p., 2019. Web.
Anderson, Iver E., Harringa, Joel L., & Boesenberg, Adam J. Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder. United States.
Anderson, Iver E., Harringa, Joel L., and Boesenberg, Adam J. Tue . "Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder". United States. https://www.osti.gov/servlets/purl/1600142.
@article{osti_1600142,
title = {Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder},
author = {Anderson, Iver E. and Harringa, Joel L. and Boesenberg, Adam J.},
abstractNote = {A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}

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Works referenced in this record:

Lead-free solder
patent, May 2001


Pb-free Sn-Ag-Cu ternary eutectic solder
patent, June 1996


Lead-free tin-silver-copper alloy solder composition
patent, October 2004


Lead-free solder
patent, October 2007


Process for forming a protective film on Cu-Sn alloys
patent, April 1984