Pb-free Sn-Ag-Cu ternary eutectic solder

Patent · Mon Jan 01 00:00:00 EST 1996

OSTI ID:870476

Anderson, Iver E ^[1]; Yost, Frederick G ^[2]; Smith, John F ^[1]; Miller, Chad M ^[1]; Terpstra, Robert L ^[1]

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1. Ames, IA
2. Cedar Crest, NM

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

• Research Organization: Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
• DOE Contract Number: W-7405-ENG-82
• Assignee: Iowa State University Research Foudation, Inc. (Ames, IA); Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5527628
• Application Number: 08/394,228
• OSTI ID: 870476
• Country of Publication: United States
• Language: English

Related Subjects

pb-free
sn-ag-cu
ternary
eutectic
solder
composition
consisting
essentially
93
weight
sn-about
ag-about
cu
melting
temperature
217
degree
variants
relative
concentrations
deviate
provide
controlled
range
liquid-solid
mushy
zone
15
composition consisting
eutectic composition
ternary eutectic
melting temperature
temperature range
consisting essentially
relative concentrations
relative concentration
eutectic solder
/428/228/420/