Pb-free Sn-Ag-Cu ternary eutectic solder
Patent
·
OSTI ID:251113
A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.
- Research Organization:
- Iowa State University
- DOE Contract Number:
- W-7405-ENG-82
- Assignee:
- Iowa State Univ. Research Foundation, Inc., Ames, IA (United States); Sandia Corp., Albuquerque, NM (United States)
- Patent Number(s):
- US 5,527,628/A/
- Application Number:
- PAN: 8-394,228
- OSTI ID:
- 251113
- Country of Publication:
- United States
- Language:
- English
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