Pb-free Sn-Ag-Cu ternary eutectic solder

Patent · Mon Jan 01 04:00:00 EST 1996

OSTI ID:870476

Anderson, Iver E ^[1]; Yost, Frederick G ^[2]; Smith, John F ^[1]; Miller, Chad M ^[1]; Terpstra, Robert L ^[1]

---

1. Ames, IA
2. Cedar Crest, NM

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

• Research Organization: Ames Laboratory (AMES), Ames, IA; Iowa State University, Ames, IA (US)
• DOE Contract Number: W-7405-ENG-82
• Assignee: Iowa State University Research Foudation, Inc. (Ames, IA); Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5527628
• Application Number: 08/394,228
• OSTI ID: 870476
• Country of Publication: United States
• Language: English

Related Subjects

/428/228/420/
15
217
93
ag-about
composition
composition consisting
concentrations
consisting
consisting essentially
controlled
cu
degree
deviate
essentially
eutectic
eutectic composition
eutectic solder
liquid-solid
melting
melting temperature
mushy
pb-free
provide
range
relative
relative concentration
relative concentrations
sn-about
sn-ag-cu
solder
temperature
temperature range
ternary
ternary eutectic
variants
weight
zone