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Lead-free solder

Patent ·
OSTI ID:873728
 [1];  [1]
  1. Ames, IA
+ Show Author Affiliations

A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

Research Organization:
Ames Laboratory (AMES), Ames, IA; Iowa State University, Ames, IA (US)
DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Number(s):
US 6231691
Application Number:
08/796,471
OSTI ID:
873728
Country of Publication:
United States
Language:
English

References (1)

Developing lead-free solders: A challenge and opportunity journal July 1993

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/148/228/420/
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ag--1
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fourth
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sn--4
sn--ag--cu
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solderability
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strength
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substrate
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ternary
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thermal-mechanical
weight
wt