Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

doi:10.1007/s11661-016-3738-6

Title: Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Journal Article · Thu Oct 06 00:00:00 EDT 2016 · Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science

DOI:https://doi.org/10.1007/s11661-016-3738-6· OSTI ID:1417369

Reeve, Kathlene N. ^[1]; Choquette, Stephanie M. ^[2]; Anderson, Iver E. ^[2]; Handwerker, Carol A. ^[1]

Purdue Univ., West Lafayette, IN (United States)
Ames Lab. and Iowa State Univ., Ames, IA (United States)

Particles of Cu _x Al _y in Sn-Cu-Al solders have previously been shown to nucleate the Cu₆Sn₅ phase during solidification. In this study, the number and size of Cu₆Sn₅ nucleation sites were controlled through the particle size refinement of Cu _x Al _y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu _x Al _y and Cu₆Sn₅ particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu _x Al _y and Cu₆Sn₅ phases. Transitions in the Cu₆Sn₅ particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 10³ to 10⁴ °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu _x Al _y /Cu₆Sn₅ nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary-β phase in the solidified alloys was noted. As a result, solidification pathways omitting the formation of the ternary-β phase agreed well with observed room temperature microstructures.

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Research Organization:: Ames Laboratory (AMES), Ames, IA (United States)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC02-07CH11358

OSTI ID:: 1417369

Report Number(s):: IS-J-9157; PII: 3738; TRN: US1801048

Journal Information:: Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science, Vol. 47, Issue 12; ISSN 1073-5623

Publisher:: ASM InternationalCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 2 works

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References (20)

Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4 Belyakov, S. A.; Gourlay, C. M. Acta Materialia, Vol. 71 https://doi.org/10.1016/j.actamat.2014.02.044	journal	June 2014
Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A. Journal of Electronic Materials, Vol. 44, Issue 3 https://doi.org/10.1007/s11664-014-3551-1	journal	January 2015
Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders Xian, J. W.; Belyakov, S. A.; Britton, T. B. Journal of Alloys and Compounds, Vol. 619 https://doi.org/10.1016/j.jallcom.2014.08.251	journal	January 2015
Ordering and structural vacancies in non-stoichiometric Cu–Al γ brasses Kisi, E. H.; Browne, J. D. Acta Crystallographica Section B Structural Science, Vol. 47, Issue 6 https://doi.org/10.1107/S0108768191005694	journal	December 1991
The Cu–Sn phase diagram, Part I: New experimental results Fürtauer, S.; Li, D.; Cupid, D. Intermetallics, Vol. 34 https://doi.org/10.1016/j.intermet.2012.10.004	journal	March 2013
The constitution of the copper-rich copper-aluminium-tin alloys, with special reference to ternary compound formation Leach, J. S. L.; Raynor, Geoffrey Vincent Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, Vol. 224, Issue 1157, p. 251-259 https://doi.org/10.1098/rspa.1954.0155	journal	June 1954
Liquid demixing and microstructure formation in ternary Al–Sn–Cu alloys Mirković, D.; Gröbner, J.; Schmid-Fetzer, R. Materials Science and Engineering: A, Vol. 487, Issue 1-2 https://doi.org/10.1016/j.msea.2007.10.043	journal	July 2008
Isothermal transformation of β-phase in Cu-rich Cu-Al-Sn alloys Chakrabarty, A. K.; Jacob, K. T. International Journal of Materials Research, Vol. 104, Issue 5 https://doi.org/10.3139/146.110881	journal	May 2013
Phase equilibria in the Cu-rich portion of the Cu–Al binary system Liu, X. J.; Ohnuma, I.; Kainuma, R. Journal of Alloys and Compounds, Vol. 264, Issue 1-2 https://doi.org/10.1016/S0925-8388(97)00235-1	journal	January 1998
The Cu–Sn phase diagram part II: New thermodynamic assessment Li, D.; Franke, P.; Fürtauer, S. Intermetallics, Vol. 34 https://doi.org/10.1016/j.intermet.2012.10.010	journal	March 2013
Crystal perfection in a noncentrosymmetric alloy. Refinement and test of twinning of the γ-Cu ₉ Al ₄ structure Arnberg, L.; Westman, S. Acta Crystallographica Section A, Vol. 34, Issue 3 https://doi.org/10.1107/S0567739478000807	journal	May 1978
The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder Frear, Darrel; Grivas, Dennis; Morris, J. W. Journal of Electronic Materials, Vol. 16, Issue 3 https://doi.org/10.1007/BF02655484	journal	May 1987
Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying Xian, J. W.; Belyakov, S. A.; Gourlay, C. M. Journal of Electronic Materials, Vol. 45, Issue 1 https://doi.org/10.1007/s11664-015-4092-y	journal	October 2015
Re-investigation of phase equilibria in the system Al–Cu and structural analysis of the high-temperature phase η1-Al1−δCu Ponweiser, Norbert; Lengauer, Christian L.; Richter, Klaus W. Intermetallics, Vol. 19, Issue 11 https://doi.org/10.1016/j.intermet.2011.07.007	journal	November 2011
Experimental Study of Phase Equilibria in the System Cu-Al-Sn Chakrabarty, A. K.; Jacob, K. T. Journal of Phase Equilibria and Diffusion, Vol. 34, Issue 4 https://doi.org/10.1007/s11669-013-0241-2	journal	May 2013
Interstitial Diffusion of Copper in Tin Dyson, B. F.; Anthony, T. R.; Turnbull, D. Journal of Applied Physics, Vol. 38, Issue 8 https://doi.org/10.1063/1.1710127	journal	July 1967
Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys McDonald, Stuart; Nogita, Kazuhiro; Read, Jonathan Journal of Electronic Materials, Vol. 42, Issue 2 https://doi.org/10.1007/s11664-012-2222-3	journal	September 2012
Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L. Journal of Electronic Materials, Vol. 41, Issue 7 https://doi.org/10.1007/s11664-012-1979-8	journal	March 2012
The aluminium-copper system Murray, J. L. International Materials Reviews, Vol. 30, Issue 1 https://doi.org/10.1179/imr.1985.30.1.211	journal	January 1985
Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E. Metallurgical and Materials Transactions A, Vol. 47, Issue 12 https://doi.org/10.1007/S11661-016-3739-5	journal	October 2016

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