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Title: Pb-free Sn-Ag-Cu ternary eutectic solder

Abstract

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

Inventors:
 [1];  [2];  [1];  [1];  [1]
+ Show Inventor Affiliations
  1. Ames, IA
  2. Cedar Crest, NM
Issue Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
OSTI Identifier:
870476
Patent Number(s):
5527628
Application Number:
08/394,228
Assignee:
Iowa State University Research Foudation, Inc. (Ames, IA); Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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DOE Contract Number:  
W-7405-ENG-82
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
pb-free; sn-ag-cu; ternary; eutectic; solder; composition; consisting; essentially; 93; weight; sn-about; ag-about; cu; melting; temperature; 217; degree; variants; relative; concentrations; deviate; provide; controlled; range; liquid-solid; mushy; zone; 15; composition consisting; eutectic composition; ternary eutectic; melting temperature; temperature range; consisting essentially; relative concentrations; relative concentration; eutectic solder; /428/228/420/

Citation Formats

Anderson, Iver E, Yost, Frederick G, Smith, John F, Miller, Chad M, and Terpstra, Robert L. Pb-free Sn-Ag-Cu ternary eutectic solder. United States: N. p., 1996. Web.
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Anderson, Iver E, Yost, Frederick G, Smith, John F, Miller, Chad M, & Terpstra, Robert L. Pb-free Sn-Ag-Cu ternary eutectic solder. United States.
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Anderson, Iver E, Yost, Frederick G, Smith, John F, Miller, Chad M, and Terpstra, Robert L. Mon . "Pb-free Sn-Ag-Cu ternary eutectic solder". United States. https://www.osti.gov/servlets/purl/870476.
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@article{osti_870476,
title = {Pb-free Sn-Ag-Cu ternary eutectic solder},
author = {Anderson, Iver E and Yost, Frederick G and Smith, John F and Miller, Chad M and Terpstra, Robert L},
abstractNote = {A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}
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