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Title: Pb-free Sn-Ag-Cu ternary eutectic solder

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).
Inventors:
 [1];  [2];  [1];  [1];  [1]
  1. (Ames, IA)
  2. (Cedar Crest, NM)
Issue Date:
OSTI Identifier:
870476
Assignee:
Iowa State University Research Foudation, Inc. (Ames, IA); Sandia Corporation (Albuquerque, NM) AMES
Patent Number(s):
US 5527628
Application Number:
08/394,228
Contract Number:
W-7405-ENG-82
Research Org:
Ames Laboratory (AMES), Ames, IA; Iowa State University, Ames, IA (US)
Country of Publication:
United States
Language:
English
Subject:
pb-free; sn-ag-cu; ternary; eutectic; solder; composition; consisting; essentially; 93; weight; sn-about; ag-about; cu; melting; temperature; 217; degree; variants; relative; concentrations; deviate; provide; controlled; range; liquid-solid; mushy; zone; 15; composition consisting; eutectic composition; ternary eutectic; melting temperature; temperature range; consisting essentially; relative concentrations; relative concentration; eutectic solder; /428/228/420/