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Title: Pb-free Sn-Ag-Cu ternary eutectic solder

Abstract

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Iowa State Univ., Ames, IA (United States)
OSTI Identifier:
251113
Patent Number(s):
5,527,628
Application Number:
PAN: 8-394,228
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States); Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
W-7405-ENG-82
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 18 Jun 1996
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; SOLDERING; FILLER METALS; CHEMICAL COMPOSITION; LEAD; TERNARY ALLOY SYSTEMS; TIN BASE ALLOYS; SILVER ALLOYS; COPPER ALLOYS; MELTING POINTS

Citation Formats

Anderson, I E, Yost, F G, Smith, J F, Miller, C M, and Terpstra, R L. Pb-free Sn-Ag-Cu ternary eutectic solder. United States: N. p., 1996. Web.
Anderson, I E, Yost, F G, Smith, J F, Miller, C M, & Terpstra, R L. Pb-free Sn-Ag-Cu ternary eutectic solder. United States.
Anderson, I E, Yost, F G, Smith, J F, Miller, C M, and Terpstra, R L. Tue . "Pb-free Sn-Ag-Cu ternary eutectic solder". United States.
@article{osti_251113,
title = {Pb-free Sn-Ag-Cu ternary eutectic solder},
author = {Anderson, I E and Yost, F G and Smith, J F and Miller, C M and Terpstra, R L},
abstractNote = {A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {6}
}