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Title: Pb-free Sn-Ag-Cu ternary eutectic solder

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.
Inventors:
; ; ; ;
Issue Date:
OSTI Identifier:
251113
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States); Sandia Corp., Albuquerque, NM (United States) PTO; SCA: 360101; PA: EDB-96:106272; SN: 96001607235
Patent Number(s):
US 5,527,628/A/
Application Number:
PAN: 8-394,228
Contract Number:
W-7405-ENG-82
Resource Relation:
Other Information: PBD: 18 Jun 1996
Research Org:
Iowa State University
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; SOLDERING; FILLER METALS; CHEMICAL COMPOSITION; LEAD; TERNARY ALLOY SYSTEMS; TIN BASE ALLOYS; SILVER ALLOYS; COPPER ALLOYS; MELTING POINTS

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