Title: Rolled-up inductor structure for a radiofrequency integrated circuit (RFIC)

Abstract

A rolled-up inductor structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis. The multilayer sheet comprises a conductive pattern layer on a strain-relieved layer, and the conductive pattern layer comprises at least one conductive strip having a length extending in a rolling direction. The at least one conductive strip thereby wraps around the longitudinal axis in the rolled configuration. The conductive pattern layer may also comprise two conductive feed lines connected to the conductive strip for passage of electrical current therethrough. The conductive strip serves as an inductor cell of the rolled-up inductor structure.

Inventors:

Li, Xiuling; Huang, Wen; Ferreira, Placid M.; Yu, Xin

Issue Date:

2015-12-29

Research Org.:

Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1234207

Patent Number(s):

9224532

Application Number:

14/051,188

Assignee:

The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H01F17/0013 - {with stacked layers}
H01F2017/006 - {flexible printed inductors}
H01F2027/2809 - {on stacked layers}
H01F2027/2857 - {Coil formed from wound foil conductor}
H01F27/2804 - {Printed windings}
H01F27/2847 - {Sheets
H01F41/02 - for manufacturing cores, coils, or magnets
H01F41/041 - {Printed circuit coils
H01F5/00 - Coils
H01F5/02 - wound on non-magnetic supports, e.g. formers

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/4814 - {Conductive parts}
H01L2223/6627 - Waveguides, e.g. microstrip line, strip line, coplanar line
H01L2223/6677 - for antenna, e.g. antenna included within housing of semiconductor device
H01L23/5227 - {Inductive arrangements or effects of, or between, wiring layers
H01L23/645 - {Inductive arrangements
H01L23/66 - High-frequency adaptations
H01L28/10 - {Inductors}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Y10T29/49071 - by winding or coiling

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DOE Contract Number:  

FG02-07ER46471

Resource Type:

Patent

Resource Relation:

Patent File Date: 2013 Oct 10

Country of Publication:

United States

Language:

English

Subject:

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS