Rolled-up electromagnetic component for on-chip applications and method of making a rolled-up electromagnetic component
A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of making a rolled-up electromagnetic component for on-chip applications includes forming a rolled-up device comprising: a multilayer sheet in a rolled configuration having at least one turn about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration. The method further includes introducing a soft magnetic material into the core.
- Research Organization:
- Univ. of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Organization:
- USDOE; National Science Foundation (NSF)
- DOE Contract Number:
- EEC 1449548; FG02-07ER46471; IIP 17-01047
- Assignee:
- The Board of Trustees of the University of Illinois (Urbana, IL)
- Patent Number(s):
- 11,031,456
- Application Number:
- 16/434,524
- OSTI ID:
- 1824060
- Resource Relation:
- Patent File Date: 06/07/2019
- Country of Publication:
- United States
- Language:
- English
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