Title: Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

Abstract

A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the first conductive film in a rolling direction. In the rolled configuration, the first conductive film surrounds the longitudinal axis, and the second conductive film surrounds the first conductive film. The first conductive film serves as a signal line and the second conductive film serves as a conductive shield for the rolled-up transmission line structure.

Inventors:

Li, Xiuling; Huang, Wen

Issue Date:

2015-04-28

Research Org.:

Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1178676

Patent Number(s):

9018050

Application Number:

14/051,192

Assignee:

The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H01F17/0013 - {with stacked layers}
H01F2017/006 - {flexible printed inductors}
H01F2027/2809 - {on stacked layers}
H01F2027/2857 - {Coil formed from wound foil conductor}
H01F27/2804 - {Printed windings}
H01F27/2847 - {Sheets
H01F41/02 - for manufacturing cores, coils, or magnets
H01F41/041 - {Printed circuit coils
H01F5/00 - Coils
H01F5/02 - wound on non-magnetic supports, e.g. formers

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/4814 - {Conductive parts}
H01L2223/6627 - Waveguides, e.g. microstrip line, strip line, coplanar line
H01L2223/6677 - for antenna, e.g. antenna included within housing of semiconductor device
H01L23/5227 - {Inductive arrangements or effects of, or between, wiring layers
H01L23/645 - {Inductive arrangements
H01L23/66 - High-frequency adaptations
H01L28/10 - {Inductors}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Y10T29/49071 - by winding or coiling

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DOE Contract Number:  

FG02-07ER46471

Resource Type:

Patent

Resource Relation:

Patent File Date: 2013 Oct 10

Country of Publication:

United States

Language:

English

Subject:

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS