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Title: Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the first conductive film in a rolling direction. In the rolled configuration, the first conductive film surrounds the longitudinal axis, and the second conductive film surrounds the first conductive film. The first conductive film serves as a signal line and the second conductive film serves as a conductive shield for the rolled-up transmission line structure.
Inventors:
;
Issue Date:
OSTI Identifier:
1178676
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL) CHO
Patent Number(s):
9,018,050
Application Number:
14/051,192
Contract Number:
FG02-07ER46471
Resource Relation:
Patent File Date: 2013 Oct 10
Research Org:
The Board of Trustees of the University of Illinois, Urbana, IL (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS

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