Title: Rolled-up transformer structure for a radiofrequency integrated circuit (RFIC)

Abstract

A rolled-up transformer structure comprises a multilayer sheet having a rolled configuration comprising multiple turns about a longitudinal axis. The multilayer sheet comprises more than one conductive pattern layer on a strain-relieved layer, including a first conductive film and a second conductive film separated from the first conductive film in a thickness direction. The first conductive film comprises an even number of primary conductive strips, where each primary conductive strip has a length extending in the rolling direction, and the second conductive film comprises an even number of secondary conductive strips, where each secondary conductive strip has a length extending in the rolling direction. In the rolled configuration, turns of the primary conductive strips and turns of the secondary conductive strips wrap around the longitudinal axis. The primary conductive strips serve as a primary winding and the secondary conductive strips serve as a secondary winding of the rolled-up transformer structure.

Inventors:

Li, Xiuling; Huang, Wen

Issue Date:

2015-01-27

Research Org.:

Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1168679

Patent Number(s):

8941460

Application Number:

14/051,208

Assignee:

The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS

H01F17/0013 - {with stacked layers}
H01F2017/006 - {flexible printed inductors}
H01F2027/2809 - {on stacked layers}
H01F2027/2857 - {Coil formed from wound foil conductor}
H01F27/2804 - {Printed windings}
H01F27/2847 - {Sheets
H01F41/02 - for manufacturing cores, coils, or magnets
H01F41/041 - {Printed circuit coils
H01F5/00 - Coils
H01F5/02 - wound on non-magnetic supports, e.g. formers

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/4814 - {Conductive parts}
H01L2223/6627 - Waveguides, e.g. microstrip line, strip line, coplanar line
H01L2223/6677 - for antenna, e.g. antenna included within housing of semiconductor device
H01L23/5227 - {Inductive arrangements or effects of, or between, wiring layers
H01L23/645 - {Inductive arrangements
H01L23/66 - High-frequency adaptations
H01L28/10 - {Inductors}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Y10T29/49071 - by winding or coiling

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DOE Contract Number:  

FG02-07ER46471

Resource Type:

Patent

Country of Publication:

United States

Language:

English

Subject:

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY