Wafer characteristics via reflectometry
Abstract
Various exemplary methods (800, 900, 1000, 1100) are directed to determining wafer thickness and/or wafer surface characteristics. An exemplary method (900) includes measuring reflectance of a wafer and comparing the measured reflectance to a calculated reflectance or a reflectance stored in a database. Another exemplary method (800) includes positioning a wafer on a reflecting support to extend a reflectance range. An exemplary device (200) has an input (210), analysis modules (222-228) and optionally a database (230). Various exemplary reflectometer chambers (1300, 1400) include radiation sources positioned at a first altitudinal angle (1308, 1408) and at a second altitudinal angle (1312, 1412). An exemplary method includes selecting radiation sources positioned at various altitudinal angles. An exemplary element (1650, 1850) includes a first aperture (1654, 1854) and a second aperture (1658, 1858) that can transmit reflected radiation to a fiber and an imager, respectfully.
- Inventors:
-
- Denver, CO
- Issue Date:
- Research Org.:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1016130
- Patent Number(s):
- 7815862
- Application Number:
- 10/535,291
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01B - MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- DOE Contract Number:
- AC36-99GO10337
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Sopori, Bhushan L. Wafer characteristics via reflectometry. United States: N. p., 2010.
Web.
Sopori, Bhushan L. Wafer characteristics via reflectometry. United States.
Sopori, Bhushan L. Tue .
"Wafer characteristics via reflectometry". United States. https://www.osti.gov/servlets/purl/1016130.
@article{osti_1016130,
title = {Wafer characteristics via reflectometry},
author = {Sopori, Bhushan L},
abstractNote = {Various exemplary methods (800, 900, 1000, 1100) are directed to determining wafer thickness and/or wafer surface characteristics. An exemplary method (900) includes measuring reflectance of a wafer and comparing the measured reflectance to a calculated reflectance or a reflectance stored in a database. Another exemplary method (800) includes positioning a wafer on a reflecting support to extend a reflectance range. An exemplary device (200) has an input (210), analysis modules (222-228) and optionally a database (230). Various exemplary reflectometer chambers (1300, 1400) include radiation sources positioned at a first altitudinal angle (1308, 1408) and at a second altitudinal angle (1312, 1412). An exemplary method includes selecting radiation sources positioned at various altitudinal angles. An exemplary element (1650, 1850) includes a first aperture (1654, 1854) and a second aperture (1658, 1858) that can transmit reflected radiation to a fiber and an imager, respectfully.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 19 00:00:00 EDT 2010},
month = {Tue Oct 19 00:00:00 EDT 2010}
}