MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
Abstract
In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1109356
- Patent Number(s):
- 8597985
- Application Number:
- 13/364,166
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, and Patrizi, Gary A. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads. United States: N. p., 2013.
Web.
Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, & Patrizi, Gary A. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads. United States.
Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, and Patrizi, Gary A. Tue .
"MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads". United States. https://www.osti.gov/servlets/purl/1109356.
@article{osti_1109356,
title = {MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads},
author = {Chanchani, Rajen and Nordquist, Christopher and Olsson, Roy H and Peterson, Tracy C and Shul, Randy J and Ahlers, Catalina and Plut, Thomas A and Patrizi, Gary A},
abstractNote = {In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {12}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Wafer-level MEMS packaging via thermally released metal-organic membranes
journal, March 2006
- Monajemi, Pejman; Joseph, Paul J.; Kohl, Paul A.
- Journal of Micromechanics and Microengineering, Vol. 16, Issue 4
Method for packaging microsensors
patent, October 2000
- Najafi, Nader; Massoud-Ansari, Sonbol
- US Patent Document 6,140,144
Solid state imaging device and manufacturing method thereof
patent, March 2011
- Yamamoto, Kiyofumi
- US Patent Document 7,901,973
Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect
journal, February 2009
- Choa, Sung-Hoon
- Microsystem Technologies, Vol. 15, Issue 5
Wafer level packaged MEMS integrated circuit
patent, December 2010
- Theuss, Horst; Loehndorf, Markus; Schoen, Florian
- US Patent Document 7,851,925