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Title: MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

Abstract

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

Inventors:
; ; ; ; ; ; ;
Issue Date:
Research Org.:
SNL-A (Sandia National Laboratories, Albuquerque, NM (United States))
Sponsoring Org.:
USDOE
OSTI Identifier:
1109356
Patent Number(s):
8,597,985
Application Number:
13/364,166
Assignee:
Sandia Corporation (Albuquerque, NM) SNL-A
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
77 NANOSCIENCE AND NANOTECHNOLOGY

Citation Formats

Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, and Patrizi, Gary A. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads. United States: N. p., 2013. Web.
Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, & Patrizi, Gary A. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads. United States.
Chanchani, Rajen, Nordquist, Christopher, Olsson, Roy H, Peterson, Tracy C, Shul, Randy J, Ahlers, Catalina, Plut, Thomas A, and Patrizi, Gary A. Tue . "MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads". United States. https://www.osti.gov/servlets/purl/1109356.
@article{osti_1109356,
title = {MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads},
author = {Chanchani, Rajen and Nordquist, Christopher and Olsson, Roy H and Peterson, Tracy C and Shul, Randy J and Ahlers, Catalina and Plut, Thomas A and Patrizi, Gary A},
abstractNote = {In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {12}
}

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