Wafer screening device and methods for wafer screening
Abstract
Wafer breakage is a serious problem in the photovoltaic industry because a large fraction of wafers (between 5 and 10%) break during solar cell/module fabrication. The major cause of this excessive wafer breakage is that these wafers have residual microcracks--microcracks that were not completely etched. Additional propensity for breakage is caused by texture etching and incomplete edge grinding. To eliminate the cost of processing the wafers that break, it is best to remove them prior to cell fabrication. Some attempts have been made to develop optical techniques to detect microcracks. Unfortunately, it is very difficult to detect microcracks that are embedded within the roughness/texture of the wafers. Furthermore, even if such detection is successful, it is not straightforward to relate them to wafer breakage. We believe that the best way to isolate the wafers with fatal microcracks is to apply a stress to wafers--a stress that mimics the highest stress during cell/module processing. If a wafer survives this stress, it has a high probability of surviving without breakage during cell/module fabrication. Based on this, we have developed a high throughput, noncontact method for applying a predetermined stress to a wafer. The wafers are carried on a belt through a chambermore »
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1143680
- Patent Number(s):
- 8780343
- Application Number:
- 13/146,111
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- DOE Contract Number:
- AC36-08GO28308
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 14 SOLAR ENERGY
Citation Formats
Sopori, Bhushan, and Rupnowski, Przemyslaw. Wafer screening device and methods for wafer screening. United States: N. p., 2014.
Web.
Sopori, Bhushan, & Rupnowski, Przemyslaw. Wafer screening device and methods for wafer screening. United States.
Sopori, Bhushan, and Rupnowski, Przemyslaw. Tue .
"Wafer screening device and methods for wafer screening". United States. https://www.osti.gov/servlets/purl/1143680.
@article{osti_1143680,
title = {Wafer screening device and methods for wafer screening},
author = {Sopori, Bhushan and Rupnowski, Przemyslaw},
abstractNote = {Wafer breakage is a serious problem in the photovoltaic industry because a large fraction of wafers (between 5 and 10%) break during solar cell/module fabrication. The major cause of this excessive wafer breakage is that these wafers have residual microcracks--microcracks that were not completely etched. Additional propensity for breakage is caused by texture etching and incomplete edge grinding. To eliminate the cost of processing the wafers that break, it is best to remove them prior to cell fabrication. Some attempts have been made to develop optical techniques to detect microcracks. Unfortunately, it is very difficult to detect microcracks that are embedded within the roughness/texture of the wafers. Furthermore, even if such detection is successful, it is not straightforward to relate them to wafer breakage. We believe that the best way to isolate the wafers with fatal microcracks is to apply a stress to wafers--a stress that mimics the highest stress during cell/module processing. If a wafer survives this stress, it has a high probability of surviving without breakage during cell/module fabrication. Based on this, we have developed a high throughput, noncontact method for applying a predetermined stress to a wafer. The wafers are carried on a belt through a chamber that illuminates the wafer with an intense light of a predetermined intensity distribution that can be varied by changing the power to the light source. As the wafers move under the light source, each wafer undergoes a dynamic temperature profile that produces a preset elastic stress. If this stress exceeds the wafer strength, the wafer will break. The broken wafers are separated early, eliminating cost of processing into cell/module. We will describe details of the system and show comparison of breakage statistics with the breakage on a production line.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 15 00:00:00 EDT 2014},
month = {Tue Jul 15 00:00:00 EDT 2014}
}
Works referenced in this record:
Light collector for optical contaminant and flaw detector
patent, July 1986
- Galbraith, Lee K.
- US Patent Document 4,601,576
Semiconductor wafer heating chamber
patent, July 1988
- Crowley, John L.; DeBolski, Thomas J.; Kermani, Ahmad
- US Patent Document 4,755,654
Method and apparatus for substrate heating in an axially symmetric epitaxial deposition apparatus
patent, December 1988
- Robinson, McDonald; Behee, Ronald D.; deBoer, Wiebe B.
- US Patent Document 4,789,771
Method for the manufacture of vacuum tubes stems
patent, July 1989
- Prost, Alain
- US Patent Document 4,846,746
Method and apparatus for inspection of a transparent container
patent, October 1989
- McMeekin, James H.; Lerch, Alan E.; Chollock, Ronald S.
- US Patent Document 4,874,940
Process and apparatus for producing temperature profiles in a workpiece as it passes through a belt furnace
patent, January 1991
- Rackerby, Robert E.; Zimmerman, Jon Lee
- US Patent Document 4,982,347
Apparatus for measuring variations in windings of coiled material
patent, August 1993
- Hess, Jerome E.
- US Patent Document 5,239,357
Back-side hydrogenation technique for defect passivation in silicon solar cells
patent, April 1994
- Sopori, Bhushan L.
- US Patent Document 5,304,509
Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones
patent, February 1995
- Takagi, Mikio
- US Patent Document 5,387,557
Apparatus for and method of rapid testing of semiconductor components at elevated temperature
patent, April 1995
- Tigelaar, Howard L.; Moslehi, Mehrdad M.
- US Patent Document 5,410,162
Impurity gettering in semiconductors
patent, June 1995
- Sopori, Bhushan L.
- US Patent Document 5,426,061
Fabrication of optically reflecting ohmic contacts for semiconductor devices
patent, July 1995
- Sopori, Bhushan L.
- US Patent Document 5,429,985
High performance multi-zone illuminator module for semiconductor wafer processing
patent, August 1995
- Moslehi, Mehrdad M.; Davis, Cecil J.; Matthews, Robert T.
- US Patent Document 5,446,825
Optical processing furnace with quartz muffle and diffuser plate
patent, September 1995
- Sopori, Bhushan L.
- US Patent Document 5,452,396
Optical processing furnace with quartz muffle and diffuser plate
patent, November 1996
- Sopori, Bhushan L.
- US Patent Document 5,577,157
Apparatus for making optically fused semiconductor powder for solar cells
patent, March 1997
- Stevens, Gary D.; Padovani, Francois A.
- US Patent Document 5,614,020
Fault detection for entire wafer stress test
patent, April 1997
- McClure, David C.
- US Patent Document 5,619,462
Application of optical processing for growth of silicon dioxide
patent, June 1997
- Sopori, Bhushan L.
- US Patent Document 5,639,520
Method for monitoring surface stress
patent, December 1997
- Nadolink, Richard H.
- US Patent Document 5,693,889
Optical method of detecting defect and apparatus used therein
patent, April 1999
- Takamoto, Kenji; Nishii, Kanji; Ito, Masami
- US Patent Document 5,894,345
High efficiency low cost thin film silicon solar cell design and method for making
patent, April 1999
- Sopori, Bhushan L.
- US Patent Document 5,897,331
Heating device for semiconductor wafers
patent, October 1999
- Gat, Arnon
- US Patent Document 5,970,214
Method of evaluating and thermally processing semiconductor wafer
patent, November 1999
- Kiyama, Makoto
- US Patent Document 5,985,678
Lid assembly for high temperature processing chamber
patent, February 2000
- Frankel, Jonathan; Shmurun, Inna; Sivaramakrishnan, Visweswaren
- US Patent Document 6,019,848
Furnace for rapid thermal processing with optical switching film disposed between heater and reflector
patent, April 2000
- Roozeboom, Freddy; Duine, Peter Alexander; Van Der Sluis, Paul
- US Patent Document 6,047,107
Method and apparatus for enhancing the efficiency of radiant energy sources used in rapid thermal processing of substrates by energy reflection
patent, June 2000
- Bahl, Suneet
- US Patent Document 6,072,160
High efficiency, low cost, thin film silicon solar cell design and method for making
patent, March 2001
- Sopori, Bhushan L.
- US Patent Document 6,201,261
Heating device containing a multi-lamp cone for heating semiconductor wafers
patent, April 2001
- Hathaway, Kevin Joseph
- US Patent Document 6,210,484
Apparatus for uniform gas and radiant heat dispersion for solid state fabrication processes
patent, May 2001
- Sandhu, Gurtej S.
- US Patent Document 6,232,580
Thermally developable material
patent, July 2001
- Hirabayashi, Kazuhiko; Sampei, Takeshi; Goto, Kenji
- US Patent Document 6,258,524
Device and method for non-contact detection of structural and/or surface faults in large surface bodies
patent, October 2002
- Meinlschmidt, Peter; Sembach, Joerg
- US Patent Document 6,461,035
Accelerated thermal stress cycle test
patent, August 2003
- Chao, Ying-Chen; Lee, Wi William; Yang, Sen
- US Patent Document 6,604,853
Periodic clamping method and apparatus to reduce thermal stress in a wafer
patent, May 2004
- Sogard, Michael
- US Patent Document 6,734,117
Edge flaw inspection device
patent, September 2004
- Hiramoto, Kazuyuki; Kanno, Takashi
- US Patent Document 6,798,503
Apparatus and method for rapid photo-thermal surfaces treatment
patent, October 2004
- Kamieniecki, Emil
- US Patent Document 6,803,588
Method for automatically controlling defect -specification in a semiconductor manufacturing process
patent, October 2004
- Wang, Sheng-Jen; Lin, Long-Hui
- US Patent Document 6,807,454
Method and apparatus for detecting defects along the edge of electronic media
patent, November 2004
- Swan, Alan; Hafner, Thomas; Howells, John
- US Patent Document 6,816,251
Metal processing for impurity gettering in silicon
patent, February 2005
- Sopori, Bhushan L.
- US Patent Document 6,852,371
Method for inspecting silicon wafer, method for manufacturing silicon wafer, method for fabricating semiconductor device, and silicon wafer
patent, March 2005
- Iwabuchi, Miho
- US Patent Document 6,861,268
Device and method for automatically inspecting objects traveling in an essentially monolayer flow
patent, September 2006
- Bourely, Antoine; Pellenc, Roger
- US Patent Document 7,113,272
Wafer characteristics via reflectometry and wafer processing apparatus and method
patent, July 2007
- Sopori, Bhushan L.
- US Patent Document 7,238,912
Wafer processing method including formation of a deteriorated layer
patent, March 2010
- Nagai, Yusuke; Kobayashi, Satoshi; Nakamura, Masaru
- US Patent Document 7,682,858
Apparatus and method for determining stress in solar cells
patent, August 2010
- Borden, Peter G.
- US Patent Document 7,773,211
Silicon wafer and process for the heat treatment of a silicon wafer
patent, November 2010
- Mueller, Timo; von Ammon, Wilfried; Daub, Erich
- US Patent Document 7,828,893
Screening of silicon wafers used in photovoltaics
patent, August 2011
- Sopori, Bhushan L.; Sheldon, Peter
- US Patent Document 8,006,566
Localized anneal
patent, September 2012
- Tan, Dexter Xueming; Lim, Chee Chong; Yeong, Sai-Hooi
- US Patent Document 8,268,733
Rapid thermal processing chamber for processing multiple wafers
patent-application, January 2002
- Gat, Arnon
- US Patent Application 09/943928; 20020005400
Defect inspection data processing system
patent-application, February 2002
- Tanaka, Toshihiko
- US Patent Application 09/910747; 20020024659
Heat treatment device of the light irradiation type and heat treatment process of the irradiation type
patent-application, April 2003
- Suzuki, Shinji; Mimura, Yoshiki
- US Patent Application 09/970928; 20030068903
Automated wafer defect inspection system and a process of performing such inspection
patent-application, January 2005
- O'Dell, Jeffrey; Verburgt, Thomas; Harless, Mark
- US Patent Application 10/915666; 20050008218
Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring
patent-application, March 2005
- Gotkis, Yehiel; Kistler, Rodney; Owczarz, Aleksander
- US Patent Application 10/671978; 20050066739
Method and its apparatus for inspecting particles or defects of a semiconductor device
patent-application, December 2005
- Nishiyama, Hidetoshi; Noguchi, Minori; Ohshima, Yoshimasa
- US Patent Application 11/190838; 20050264798
Wafer inspection system and method thereof
patent-application, December 2005
- Kim, Kwang-soo; Shin, Koung-su; Choi, Seung-min
- US Patent Application 11/132352; 20050282299
Monitoring semiconductor wafer defects below one nanometer
patent-application, February 2006
- Weng, Wu-An; Hsu, Wang-Tsai; Liu, Kun-Yu
- US Patent Application 10/924426; 20060037941
Apparatus and method for thermal processing
patent-application, August 2006
- Kawase, Fumitoshi; Shibata, Satoshi
- US Patent Application 11/353145; 20060186354
System for heat treatment of semiconductor device
patent-application, May 2007
- Park, Wang Jun; Kim, Jung Bae; Ahn, Young Jae
- US Patent Application 11/598447; 20070122936
Controlled process and resulting device
patent-application, May 2007
- Henley, Francois J.; Cheung, Nathan W.
- US Patent Application 11/627920; 20070122995
Structure and Method for Thermally Stressing or Testing a Semiconductor Device
patent-application, October 2007
- La Rosa, Giuseppe; Kolvenbach, Kevin W.; Massey, John Greg
- US Patent Application 11/307324; 20070235769
Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate
patent-application, December 2008
- Ueno, Tsutomu; Otoda, Kenji; Yamamoto, Koji
- US Patent Application 11/722355; 20080305615
Screening of Silicon Wafers Used in Photovoltaics
patent-application, June 2010
- Sopori, Bhushan L.; Sheldon, Peter
- US Patent Application 11/722981; 20100136715
Optical Cavity Furnace for Semiconductor Wafer Processing
patent-application, January 2011
- Sopori, Bhushan L.
- US Patent Application 12/919433; 20110003485
Method to Reduce Dislocation Density in Silicon Using Stress
patent-application, March 2011
- Bounassisi, Anthony; Bertoni, Mariana; Argon, Ali
- US Patent Application 12/892370; 20110073869
A high throughput, noncontact system for screening silicon wafers predisposed to breakage during solar cell production
conference, June 2011
- Sopori, Bhushan; Rupnowski, Przemyslaw; Basnyat, Prakash
- 2011 37th IEEE Photovoltaic Specialists Conference (PVSC)
High-flux solar furnace processing of silicon solar cells
conference, January 1994
- Tsuo, Y. S.; Pitts, J. R.; Landry, M. D.
- Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC)
Graphic script provides quick classification of GaAs wafers
journal, March 2000
- Mier, Millard G.
- III-Vs Review, Vol. 13, Issue 2, p. 47-50
Non-destructive optical methods for assessing defects in production of Si or SiGe materials
journal, July 2004
- Higgs, V.; Laurent, N.; Fellous, C.
- The European Physical Journal Applied Physics, Vol. 27, Issue 1-3
