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U.S. Department of Energy
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Low-pressure chemical vapor deposition of amorphous silicon photovoltaic devices. Annual technical progress report, 1 May 1984-30 April 1985

Technical Report ·
DOI:https://doi.org/10.2172/5965186· OSTI ID:5965186
Intrinsic and doped a-Si:H films were deposited by low pressure chemical vapor deposition (CVD) for disilane. Intrinsic layers were deposited at growth rates as high as 50 A/s. A chemical reaction engineering model that quantitatively describes the CVD reactor behavior has been developed. CVD intrinsic material was characterized by measurements of impurities, optical band gap, photoconductivity, activation energy, diffusion length, and density of states. Photovoltaic cells of the p-i-n type with efficiencies of 4% and 3.6% were fabricated using CVD intrinsic layers deposited at 1 A/s and 9 A/s, respectively. A maximum short-circuit current of 11 mA/cm/sup 2/ under 87.5 MW/cm/sup 2/ ELH illumination was obtained with boron-compensated CVD intrinsic material. Efficiency-limiting mechanisms in CVD cells were quantitatively analyzed and related to fundamental properties.
Research Organization:
Delaware Univ., Newark (USA). Inst. of Energy Conversion
DOE Contract Number:
AC02-83CH10093
OSTI ID:
5965186
Report Number(s):
SERI/STR-211-2900; ON: DE86004435
Country of Publication:
United States
Language:
English