Comparison of metallization systems for thin film hybrid microcircuits. Part II. Corrosion susceptibility and solderability

Conference · Thu Nov 01 04:00:00 EST 1979

OSTI ID:5688692

Raut, M. K.; Hines, R. A.

Corrosion susceptibility and solderability were evaluated for thin film Cr/Pd/Au, Ti/Pd/Au, and the currently used evaporated chromium/gold system. Both evaporated and electroplated gold were included in the Cr/Pd/Au and Ti/Pd/Au samples. For the corrosion susceptibility evaluation, circuits from each system were exposed to various solutions used in the fabrication process, and the percent change in interface resistance was measured as a function of time. For the solderability evaluation, solder filled via resistance and solder bond strengths were measured after temperature cycling. The electroplated gold systems with a palladium layer showed better corrosion resistance and solderability than evaporated chromium/gold.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5688692
• Report Number(s): BDX-613-2336; CONF-800118-1
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ALLOYS
CHEMICAL COMPOSITION
CHEMICAL REACTIONS
CHROMIUM ALLOYS
COMPARATIVE EVALUATIONS
CORROSION
CORROSION RESISTANT ALLOYS
ELECTRONIC CIRCUITS
ETCHING
EVALUATION
FABRICATION
GOLD ALLOYS
JOINING
METALLOGRAPHY
MICROELECTRONIC CIRCUITS
PALLADIUM ALLOYS
PLATINUM METAL ALLOYS
SOLDER FLUXES
SOLDERING
SPECIFICATIONS
SURFACE FINISHING
THERMAL CYCLING
TITANIUM ALLOYS
WELDING