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Comparison of metallization systems for thin film hybrid microcircuits. Part I. Fabrication and lead frame bondability

Conference ·
OSTI ID:5489625
;
Cr/Pd/Au and Ti/Pd/Au metallization systems with either evaporated or electroplated gold were evaluated relative to the currently used Cr/Au (evaporated) system. A description of the five systems and the process steps used to fabricate thin film networks are discussed. Over 7000 leads from thermocompression bonded lead frames were pull tested to determine the bondability and adhesion characteristics of the film.
Research Organization:
Bendix Corp., Kansas City, MO (USA)
DOE Contract Number:
EY-76-C-04-0613
OSTI ID:
5489625
Report Number(s):
BDX-613-2332; CONF-800118-2
Country of Publication:
United States
Language:
English

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Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
ALLOYS
BONDING
CHROMIUM ALLOYS
COMPARATIVE EVALUATIONS
CORROSION RESISTANT ALLOYS
ELECTRONIC CIRCUITS
EVALUATION
FABRICATION
GOLD ALLOYS
JOINING
METALLOGRAPHY
MICROELECTRONIC CIRCUITS
PALLADIUM ALLOYS
PLATINUM METAL ALLOYS
SOLDER FLUXES
SPECIFICATIONS
TITANIUM ALLOYS