Comparison of metallization systems for thin film hybrid microcircuits
Five metallization systems were evaluated for fabricating thin film hybrid microcircuits. The titanium/palladium/electroplated gold system proved superior in terms of thermocompression bondability, corrosion resistance, and solderability.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5031901
- Report Number(s):
- BDX-613-2489
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360105* -- Metals & Alloys-- Corrosion & Erosion
ALLOYS
BONDING
CHROMIUM ALLOYS
COMPARATIVE EVALUATIONS
CORROSION RESISTANCE
FABRICATION
GOLD ALLOYS
JOINING
PALLADIUM ALLOYS
PLATINUM METAL ALLOYS
SOLDERING
TITANIUM ALLOYS
WELDING
360101 -- Metals & Alloys-- Preparation & Fabrication
360105* -- Metals & Alloys-- Corrosion & Erosion
ALLOYS
BONDING
CHROMIUM ALLOYS
COMPARATIVE EVALUATIONS
CORROSION RESISTANCE
FABRICATION
GOLD ALLOYS
JOINING
PALLADIUM ALLOYS
PLATINUM METAL ALLOYS
SOLDERING
TITANIUM ALLOYS
WELDING