Feasibilty of electroplated gold for hybrid microcircuits

Technical Report · Sun Jan 01 04:00:00 EST 1978

DOI:https://doi.org/10.2172/6167840· OSTI ID:6167840

Blessner, P L

Electroplating was investigated as a method of providing thick gold films. Because electroplated gold has never been used for hybrid microcircuit (HMC) substrate metallization, this feasibility study was also designed to determine the characteristics of electroplated gold and its compatibility with present HMC fabrication processes. Ceramic substrates 95 by 114 mm (3.75 by 4.5 in.) were electroplated with 6, 10, and 25 ..mu..m of gold after 0.02 ..mu..m of chromium and 0.5 ..mu..m of gold had been either sputtered or vacuum evaporated onto the substrate surfaces. Substrates vacuum evaporated with 6 ..mu..m of gold were used as a control group. The substrates were evaluated for via resistance, RF electrical characteristics, conductor definition and resolution, solder wettability, thermocompression bondability, and environmental stability.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6167840
• Report Number(s): BDX-613-2114
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
360104 -- Metals & Alloys-- Physical Properties
BONDING
CERAMICS
CHROMIUM
CRYSTAL STRUCTURE
DEPOSITION
DIMENSIONS
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
ELEMENTS
FABRICATION
FEASIBILITY STUDIES
FILMS
GOLD
JOINING
LYSIS
METALS
PHYSICAL PROPERTIES
PLATING
SOLDERING
STABILITY
SUBSTRATES
SURFACE COATING
THICKNESS
TRANSITION ELEMENTS
WELDING
WETTABILITY