Feasibility of electroplated gold for hybrid microcircuits. Final report
Electroplated gold was investigated as a feasible alternative to vacuum evaporated gold for use as a conductive metallization layer on hybrid microcircuits (HMC) substrates. Conductor definition and resolution, RF electrical characteristics, via resistance, solder wettability, thermocompression bondability, and environmental stability of 6, 10 and 25 ..mu..m electroplated gold films were examined and compared to 6 ..mu..m evaporated gold films. No incompatibilities were found between electroplated gold and HMC requirements or fabrication processes.
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 5304230
- Report Number(s):
- BDX-613-1740
- Country of Publication:
- United States
- Language:
- English
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