Plating hybrid microcircuits. Final report
A nonproprietary and a proprietary gold plating bath were investigated to determine if they were capable of producing thick (76 ..mu..m) films for rf hybrid microcircuits. Both solutions were found to produce high purity, soft gold deposits over a wide range of plating conditions. Test circuits plated with 6, 10, and 25 ..mu..m gold deposits passed the HMC production requirements of bondability, through-hole resistance, and other electrical characteristics.
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- DOE Contract Number:
- E(29-1)-613
- OSTI ID:
- 7349312
- Report Number(s):
- BDX-613-1575
- Country of Publication:
- United States
- Language:
- English
Similar Records
Feasibility of electroplated gold for hybrid microcircuits. Final report
Feasibilty of electroplated gold for hybrid microcircuits
Necessity of characterizing hybrid microcircuit elements at microwave frequencies
Technical Report
·
Mon Oct 31 23:00:00 EST 1977
·
OSTI ID:5304230
Feasibilty of electroplated gold for hybrid microcircuits
Technical Report
·
Sat Dec 31 23:00:00 EST 1977
·
OSTI ID:6167840
Necessity of characterizing hybrid microcircuit elements at microwave frequencies
Technical Report
·
Sun Aug 01 00:00:00 EDT 1976
·
OSTI ID:7145312