Phase 2 of the automated array assembly task of the low-cost silicon solar array project. Technical quarterly report No. 4, April 1-June 30, 1979

Technical Report · Mon Jan 01 04:00:00 EST 1979

DOI:https://doi.org/10.2172/5629155· OSTI ID:5629155

Coleman, M G; Pryor, R A; Sparks, T G

During this period, all tasks progressed according to scheduled plans. This report highlights the process verification efforts, ion implantation investigations, plasma etching, and cost factors in the metallization processes. Completed modules were delivered to JPL to demonstrate the process sequence. A surface film has been observed on ion implanted wafers which was tentatively been associated with break-down of the vacuum pump oil during implantation. A baseline process for plasma patterning of silicon nitride on a silicon substrate has been specified. In addition, copper has been shown to have strong cost advantages over other metals for a conductor layer; and nickel has been identified as a desirable barrier between copper and silicon.

• Research Organization: Motorola, Inc., Phoenix, AZ (USA). Semiconductor Group
• DOE Contract Number: NAS-7-100-954847
• OSTI ID: 5629155
• Report Number(s): DOE/JPL/954847-79/5
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
140501* -- Solar Energy Conversion-- Photovoltaic Conversion
AUTOMATION
COST
DIRECT ENERGY CONVERTERS
ELECTRIC CONTACTS
ELECTRICAL EQUIPMENT
EQUIPMENT
ETCHING
IMPURITIES
ION IMPLANTATION
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
PROCESSING
PRODUCTION
RESEARCH PROGRAMS
SILICON SOLAR CELLS
SOLAR CELLS
SOLAR EQUIPMENT
SURFACE FINISHING