Impact of Die Adhesives on MEMS Reliability.

Conference · Sat Dec 01 00:00:00 EST 2007

OSTI ID:1146318

Hochrein, James Michael; Baker, Michael; Brown, Jason R.; Jakaboski, Blake E.; Mitchell, John Anthony; Thornberg, Steven M.; Wavrik, Richard William; WHITE, MICHAEL I.

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1146318
• Report Number(s): SAND2007-8158C; 519790
• Resource Relation: Conference: Proposed for presentation at the Components for military and space electronics held February 10-14, 2008 in San Diego, CA.
• Country of Publication: United States
• Language: English