SCRIBE-AND-BREAK FOR POST RELEASE MEMS DIE SEPARATION.
Conference
·
OSTI ID:1727346
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1727346
- Report Number(s):
- SAND2005-7703P; 525992
- Country of Publication:
- United States
- Language:
- English
Similar Records
Scribe-and-break for post release MEMS die separation.
Impact of Die Adhesives on MEMS Reliability.
Effects of high G-loading on MEMS structure and die attachment.
Conference
·
Wed Sep 01 00:00:00 EDT 2004
·
OSTI ID:876238
Impact of Die Adhesives on MEMS Reliability.
Conference
·
Fri Nov 30 23:00:00 EST 2007
·
OSTI ID:1146318
Effects of high G-loading on MEMS structure and die attachment.
Conference
·
Sun Aug 01 00:00:00 EDT 2010
·
OSTI ID:1122464