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Title: Impact of Die Adhesives on MEMS Reliability.

Abstract

Abstract not provided.

Authors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1146318
Report Number(s):
SAND2007-8158C
519790
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Components for military and space electronics held February 10-14, 2008 in San Diego, CA.
Country of Publication:
United States
Language:
English

Citation Formats

Hochrein, James Michael, Baker, Michael, Brown, Jason R., Jakaboski, Blake E., Mitchell, John Anthony, Thornberg, Steven M., Wavrik, Richard William, and WHITE, MICHAEL I. Impact of Die Adhesives on MEMS Reliability.. United States: N. p., 2007. Web.
Hochrein, James Michael, Baker, Michael, Brown, Jason R., Jakaboski, Blake E., Mitchell, John Anthony, Thornberg, Steven M., Wavrik, Richard William, & WHITE, MICHAEL I. Impact of Die Adhesives on MEMS Reliability.. United States.
Hochrein, James Michael, Baker, Michael, Brown, Jason R., Jakaboski, Blake E., Mitchell, John Anthony, Thornberg, Steven M., Wavrik, Richard William, and WHITE, MICHAEL I. 2007. "Impact of Die Adhesives on MEMS Reliability.". United States. https://www.osti.gov/servlets/purl/1146318.
@article{osti_1146318,
title = {Impact of Die Adhesives on MEMS Reliability.},
author = {Hochrein, James Michael and Baker, Michael and Brown, Jason R. and Jakaboski, Blake E. and Mitchell, John Anthony and Thornberg, Steven M. and Wavrik, Richard William and WHITE, MICHAEL I.},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1146318}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Dec 01 00:00:00 EST 2007},
month = {Sat Dec 01 00:00:00 EST 2007}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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