Power electronics cooling apparatus

Patent · Sat Jan 01 00:00:00 EST 2000

OSTI ID:872821

Sanger, Philip Albert ^[1]; Lindberg, Frank A ^[2]; Garcen, Walter ^[3]

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1. Monroeville, PA
2. Baltimore, MD
3. Glen Burnie, MD

A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.

• Research Organization: Northrop Grumman Corp. (Los Angeles, CA)
• DOE Contract Number: FC36-94GO10017
• Assignee: Northrop Grumman Corp. (Los Angeles, CA)
• Patent Number(s): US 6016007
• OSTI ID: 872821
• Country of Publication: United States
• Language: English

Related Subjects

power
electronics
cooling
apparatus
semiconductor
arrangement
affixed
thermally
electrically
conducting
carrier
brazing
coefficient
thermal
expansion
closely
matched
operation
overstressed
mechanically
due
cycling
electrical
connection
porous
metal
heat
exchanger
connected
positioned
insulating
assembly
oil
flowing
therethrough
particularly
adapted
switching
elements
bridge
power switching
porous metal
thermal cycling
electrically insulating
thermal expansion
heat exchange
heat exchanger
electrically conducting
electrical connection
flowing therethrough
cooling apparatus
metal heat
oil flow
switching elements
thermally connected
cooling assembly
cooling arrangement
closely match
switching element
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